"cmp slurry"

MRR CeO2 الزجاج الأمامي مسحوق التلميع للأراضي النادرة لصنع الدوائر المتكاملة

Polishing Powder for Integrated Circuit Fabrication Description Enable the next generation of semiconductor performance with ourSeries Cerium Oxide (CeO₂) Polishing Powders. Engineered specifically for Chemical Mechanical Planarization (CMP) within IC fabrication, our powders are optimized for nodes. The complexity of multi-layer interconnects and vertical scaling demands unprecedented surface planarity. Our high-activity ceria powders provide the atomic-level smoothness and