"powder rare earth product"
Solid Rare Metal Earth Cerium Acetate Hydrate Powder For Catalyst
Cerium Acetate Molecular Formula: Ce(AC)xHO Appearance: Cerium acetate is a white snowflake-like solid Application: Used as a raw material for other cerium salts and cerium oxide, as well as petroleum additives, etc. Item Specification Testing Standard Item Ce(AC)3-3N5 Ce(AC)3-4N Ce(AC)3-4N5 Ce(AC)3-5N TREO(wt%) 45 45 45 45 Rare Earth Relative Purity (wt%) La2O3/TREO 0.01 0.005 0.003 0.0004 GB/T 18115.2 CeO2/TREO 99.95 99.99 99.995 99.999 Pr6O11/TREO 0.01 0
Anhydrous Dysprosium Powder Neodymium Chloride raw material
Anhydrous Neodymium Chloride Molecular Formula: NdClAppearance: Anhydrous neodymium chloride is a pink powdery crystal. Application: Used for producing metallic neodymium, as a raw material in the field of pharmaceutical catalysis or single crystal growth. Item Specification Testing Standard Grade NdCl-3N NdCl-3N5 NdCl-4N / TREO (wt%) 66.0 66.0 66.0 / Rare Earth Relative Purity (wt%) Refer to GB/T 18115.1 LaO/TREO 0.02 0.01 0.001 CeO/TREO 0.02 0.01 0.001 PrO
Low Chloride Cerium Lanthanum Carbonate Powder Petroleum Additives
Petroleum Additives Low Chloride Lanthanum Cerium Carbonate Molecular Formula: (LaCe)(CO) Appearance: Low chloride lanthanum cerium carbonate is a white powder Application: Used for the production of rare earth polishing powder Item Specification Testing Standard Item (LaCe)2(CO3)3-65CeA1 (LaCe)2(CO3)3-65CeA2 TREO(wt%) 45.0 45.0 Lanthanum-Cerium Distribution and Rare Earth Impurities (wt%) La2O3/TREO 352 352 GB/T 16484.3 CeO2 /TREO 652 652 Pr6O11 /TREO 0.01 0.005
Cerium Oxide Spherical Catalyst Powder Polishing Material
HIGH SPECIFIC SURFACE AREA CERIUM OXIDE SPHERICAL POWDER FOR CERIUM-BASED CATALYSTS Cerium Oxide Molecular Formula: CeO Appearance: Light yellow powder Uses: Used as polishing material or as a catalyst. Item Specifications Test Method Item CeO2-3N5C CeO2-4NC CeO2-4N5C CeO2-5NC TREO(wt%) 99.0 99.0 99.0 99.0 Rare Earth Relative Purity (wt%) La2O3/TREO 0.01 0.005 0.003 0.0004 GB/T 18115.2 CeO2/TREO 99.95 99.99 99.995 99.999 Pr6O11/TREO 0.01 0.002 0.001 0.0002
High Precision Sapphire Optical Polishing Powder Cas 1306-38-3 OEM
Cerium Oxide Polishing Powder for Electronics Components Overview: Our Polishing Powder for Optical Surface Finishing is expertly designed to deliver flawless, high-precision finishes for optical components. Formulated with premium cerium oxide, this powder provides exceptional performance in polishing delicate optical surfaces, ensuring the highest levels of clarity, smoothness, and accuracy. Whether you're working with lenses, mirrors, prisms, or other optical devices, our
White CeO2 Cerium Based Glass Polishing Powder 0.5μm OEM
Polishing Powder For Plate Glass Description Lichen Polishing Powder for Plate Glass is a high-quality abrasive material developed for the surface finishing and defect correction of flat and plate glass. Formulated with carefully controlled particle size distribution and stable abrasive characteristics, this polishing powder delivers efficient material removal, smooth surface finish, and consistent polishing performance across large glass areas. It is widely used in
CeO2 Cerium Oxide Optical Polishing Powder Compound Customized
Polishing Powder for Anti-Reflection Coating on Advanced Optics Description Optimize your thin-film performance with our High-Purity Cerium Oxide (CeO) Polishing Powders, specifically engineered for the precision optics market. Achieving a high-efficiency Anti-Reflection (AR) coating begins with the substrate; our powders deliver the angstrom-level surface roughness and ultra-clean topography necessary for maximum coating adhesion and minimal light scatter. As laser systems
CMP Cerium Polish Powder Cerium Oxide For Glass Polishing Silicon Wafer
Polishing Powder for Silicon Wafer CMP Description Achieve the extreme planarity required for semiconductor nodes with our Advanced Cerium Oxide (CeO) Polishing Powders. Specifically engineered for Chemical Mechanical Planarization (CMP), our powders are designed for the high-volume manufacturing of silicon wafers, delivering the atomic-level smoothness essential for sub-7nm logic and 3D NAND memory architectures. Our formulations utilize precisely controlled particle
Anti Reflective Solar Glass Cerium Oxide Polishing Powder Material Cas 1306-38-3
Cerium Oxide For Finishing Anti-reflective Solar Glass Description Lichen Cerium Oxide for Finishing Anti-Reflective Solar Glass is an advanced cerium oxide-based polishing powder formulated to provide the smooth, clear, and defect-free finishes required for solar glass with anti-reflective coatings. Designed for solar panel glass polishing, this high-purity polishing powder enhances the optical performance of photovoltaic systems, ensuring optimal light transmission and
Chemical Mechanical Planarization CMP Cerium Oxide Polishing Powder Lapidary
Polishing Powder For Chemical Mechanical Planarization (CMP) Process Description Lichen Polishing Powder for Chemical Mechanical Planarization (CMP) is a high-performance cerium oxide-based polishing powder designed to deliver superior surface planarization and precision polishing in semiconductor wafer processing. Our polishing powder is specifically formulated to enhance material removal rates, ensuring uniformity and flatness during the CMP process, which is crucial for
Precision Ceo2 Cerium Oxide PH Neutral Polishing Powder High Purity 99%
High Purity Cerium Oxide Polishing Powder 99% Overview: Our High Purity Cerium Oxide Polishing Powder 99% is designed for precision polishing applications where the highest standards of quality, efficiency, and surface smoothness are required. Manufactured to a purity level of 99%, this cerium oxide polishing powder is ideal for polishing a wide range of materials, including glass, optical components, semiconductor wafers, and ceramics, ensuring exceptional surface finishes
OEM Cerium Oxide Glass Powder Polish Slurry Powder For Semiconductor Windshield
High Purity Cerium Oxide Slurry for Semiconductor Description Deliver atomic-level planarity for the most demanding 2026 semiconductor nodes with our High-Purity Cerium Oxide (Ceria) Slurries. Specifically engineered for Chemical Mechanical Planarization (CMP). Atomic-Scale Planarization: Achieve superior surface finishes with root-mean-square (RMS) roughness below 0.2 nm, essential for the ultra-fine geometries of next-generation integrated circuits. Integrated Self-Stopping
