CMP Rare Earth Polishing Slurry Chemical Mechanical Planarization Slurries For Semiconductor Wafer
Product Details
| Particle Size: | 2.0±0.2μm | CAS No.: | 1306-38-3 |
|---|---|---|---|
| CeO₂: | 99% | Suspension Rate: | High |
| PH Range: | 7-10 | Formulation: | Customized |
| Highlight |
Wafer Rare Earth Polishing Slurry,Semiconductor Rare Earth Polishing Slurry,CMP chemical mechanical planarization slurries |
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Product Description
Custom CMP Polishing Slurry for Semiconductor Wafer
Overview:
Our Custom CMP Polishing Slurry is specifically designed to meet the high-precision demands of semiconductor wafer polishing. Utilizing advanced cerium oxide technology, this slurry provides superior performance in Chemical Mechanical Planarization (CMP) applications, offering a customized solution for a variety of semiconductor materials.
Key Features:
Tailored Formulation: Customizable slurry composition for different semiconductor materials and specific wafer requirements. Whether polishing silicon, gallium arsenide (GaAs), or other materials, our slurry can be fine-tuned to your needs.
High Purity Cerium Oxide: Engineered for optimal polishing efficiency, ensuring minimal surface damage and superior removal rates for semiconductor wafers.
Low Defect Rate: Designed to reduce defects such as scratches, pits, and residue, ensuring the wafer surface is smooth and free from imperfections.
Enhanced CMP Performance: Provides exceptional planarity, helping to achieve flat and uniform wafer surfaces essential for photolithography and device fabrication.
Stable & Consistent: Formulated to maintain consistent performance across extended polishing cycles, improving overall process reliability and yield.
Product Benefits:
Customization: Adaptable formulation allows the slurry to meet the exact requirements of your wafer material and polishing process, enhancing polishing efficiency and uniformity.
Superior Planarity: Ensures optimal CMP performance, delivering highly planar surfaces with reduced roughness and minimal defects.
Longer Tool Life: Designed to work efficiently with polishing pads, extending tool and pad life, which helps reduce overall production costs.
Reliable Process Control: Maintains stable performance, contributing to predictable outcomes and greater control over the polishing process.
Tech Data
| Molecular Formula | CAS No. | CeO₂ % | D50 (μm) | Appearance | Application |
| CeO2 | 1306-38-3 | 99% | 2.0±0.2 | White Slurry | Semiconductor Wafer |
Q&A
1. What is rare earth polishing powder?
Rare earth polishing powder is a high-purity compound used for polishing optical components, semiconductor wafers, and delicate surfaces like glass and lenses. It delivers a smooth, high-clarity finish without damaging the material.
2. How do I choose the right rare earth polishing powder for my application?
To select the ideal polishing powder, consider factors like the material you’re polishing, the required finish, and specifications like particle size and purity. Our sales team is available to help you choose the perfect product for your needs.
3. How should I store rare earth polishing powder?
Store in a cool, dry place, away from moisture and direct sunlight. Keep the powder in airtight containers to prevent contamination and maintain its effectiveness. With proper storage, it typically lasts 1-2 years.
4. Do you provide customized rare earth formulations?
Yes, we offer custom rare earth polishing powders and slurries, tailored to meet your specific needs, including adjustments to particle size, chemical composition, or slurry consistency.
5. Can I get a sample before making a bulk order?
Absolutely! We provide samples for evaluation. Contact our team to request a sample, and we’ll arrange the shipment.
6. How can I place an order? What is the typical delivery time?
To place an order, simply contact our sales team, who will guide you through the process and provide a quote. Delivery times vary based on order size, location, and stock availability, and we’ll give you an estimated schedule once the order is confirmed.
Product Highlights
Custom CMP Polishing Slurry for Semiconductor Wafer Overview: Our Custom CMP Polishing Slurry is specifically designed to meet the high-precision demands of semiconductor wafer polishing. Utilizing advanced cerium oxide technology, this slurry provides superior performance in Chemical Mechanical ...
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Cerium Oxalate Powder Chemical Reagent Elements
Cerium oxalate is an oxalate salt of trivalent cerium and an important rare earth compound, often existing in the form of hydrate. 1. Basic Information English Name: Cerium(III) oxalate, Cerous oxalate Chemical Formula: (usually hydrate, where x is mostly 9 or 10) Molecular Weight (Anhydrous): 544.29 : Anhydrous: 139-42-4 Hydrate: 15750-47-7 2. Physical and Chemical Properties Appearance: White or pale yellow crystalline powder, odorless and tasteless. Solubility: Practically
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