OEM Cerium Oxide for Sapphire & Wafer Precision Finishing
Dettagli del prodotto
| Formula chimica: | CeO2 | N. CAS: | 1306-38-3 |
|---|---|---|---|
| Purezza del CeO₂: | ≥99% | Dimensione delle particelle: | 0,2 μm – 1,5 μm |
| Aspetto: | Polvere giallo chiaro | Confezione: | Personalizzabile |
| Evidenziare |
OEM Cerium Oxide Sapphire Polishing,Cerium Oxide Wafer Precision Finishing,Rare Earth Polishing Powder OEM |
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Descrizione di prodotto
Caratteristiche del prodotto
OEM Cerium Oxide for Sapphire & Wafer Precision Finishing Product Overview Custom OEM cerium oxide polishing powder designed for ultra-precision finishing of sapphire substrates, optical wafers and ceramic components. We tune hardness, cutting force and grain uniformity to reduce surface defects. ...
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OEM Cerium Oxide for Sapphire & Wafer Precision Finishing
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