OEM Cerium Oxide for Sapphire & Wafer Precision Finishing
Product Details
| Chemical Formula: | CeO₂ | CAS No.: | 1306-38-3 |
|---|---|---|---|
| CeO₂ Purity: | ≥99% | Particle Size: | 0.2 μm – 1.5 μm |
| Appearance: | Light Yellow Powder | Packaging: | Customizable |
| Highlight |
OEM Cerium Oxide Sapphire Polishing,Cerium Oxide Wafer Precision Finishing,Rare Earth Polishing Powder OEM |
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Product Description
OEM Cerium Oxide for Sapphire & Wafer Precision Finishing
Product Overview
Custom OEM cerium oxide polishing powder designed for ultra-precision finishing of sapphire substrates, optical wafers and ceramic components. We tune hardness, cutting force and grain uniformity to reduce surface defects. This cerium oxide can be supplied as dry powder or pre-mixed polishing slurry under OEM brand.
Key Features
- OEM tailored grain hardness & PSD to minimize scratches and sub-surface damage
- Option to supply as dry powder or ready-to-use OEM polishing slurry
- High removal rate while maintaining ultra-low surface roughness after polishing
- Strict batch consistency for semiconductor & optoelectronic precision manufacturing
- Custom particle fraction screening to eliminate oversized coarse particles
Particle Size Distribution

Applications
Ultra-precision polishing for sapphire window, ceramic components, optical wafer; functional additive for advanced ceramic sintering.
Frequently Asked Questions
Q: Can you produce OEM polishing slurry based on our solid content requirement?
A: We support OEM slurry production with adjustable solid content, dispersant and pH value.
Q: What is the MOQ for OEM custom grade?
A: MOQ depends on formulation; small trial order is acceptable for new product development.
Product Highlights
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OEM Cerium Oxide for Sapphire & Wafer Precision Finishing
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