100 Results For

"high purity rare earth material"

Quality Quartz Glass Cerium Oxide Polishing Powder cas 1306-38-3 Customized factory

Quartz Glass Cerium Oxide Polishing Powder cas 1306-38-3 Customized

Cerium Oxide For Polishing Quartz Glass Substrates Description Lichen Cerium Oxide for Polishing Quartz Glass Substrates is a high-purity cerium-based polishing powder developed specifically for the demanding requirements of quartz glass finishing. With optimized particle size distribution and excellent chemical-mechanical polishing behavior, it enables superior surface smoothness, low defect density, and consistent material removal on fused quartz and synthetic quartz

Quality Fine Planarization Cerium Oxide Slurry For Semiconductor Glass factory

Fine Planarization Cerium Oxide Slurry For Semiconductor Glass

Slurry For Fine Planarization Of Semiconductor Glass Description Lichen Cerium-Based Polishing Slurry for Fine Planarization of Semiconductor Glass is a high-purity, ready-to-use slurry engineered for advanced glass planarization processes in semiconductor manufacturing. Formulated with precisely controlled cerium oxide particles, this slurry delivers excellent surface flatness, low roughness, and minimal defect generation, meeting the stringent requirements of modern

Quality Customized Cerium Polishing Powder Paste For Semiconductor Wafer Polishing factory

Customized Cerium Polishing Powder Paste For Semiconductor Wafer Polishing

Polishing Powder For Ultra-Fine Wafer Polishing Description Lichen Cerium-Based Polishing Slurry for Fine Planarization of Semiconductor Glass is a high-purity, ready-to-use slurry engineered for advanced glass planarization processes in semiconductor manufacturing. Formulated with precisely controlled cerium oxide particles, this slurry delivers excellent surface flatness, low roughness, and minimal defect generation, meeting the stringent requirements of modern semiconducto

Quality Planarization Cerium Oxide Slurry Abrasive Polishing Paste For Semiconductor Glass factory

Planarization Cerium Oxide Slurry Abrasive Polishing Paste For Semiconductor Glass

Cerium Oxide Slurry For Semiconductor Glass Substrates Description Lichen Cerium Oxide Slurry for Semiconductor Glass Substrates is a high-purity, water-based polishing slurry formulated specifically for semiconductor glass applications. This slurry provides excellent material removal rates, consistent surface finishes, and precise planarization, making it ideal for polishing semiconductor glass substrates used in wafer-level packaging, photomasks, and advanced integrated

Quality 2.2μM Ph Neutral Polishing CMP Slurry For Glass Wafer Substrates factory

2.2μM Ph Neutral Polishing CMP Slurry For Glass Wafer Substrates

CMP Slurry For Glass Wafer Substrates Description Lichen CMP Slurry for Glass Wafer Substrates is a high-purity, ready-to-use polishing slurry formulated for precision chemical-mechanical planarization (CMP) of glass wafer substrates. Designed for the advanced semiconductor, photonics, and microelectronics industries, this slurry ensures optimal material removal, uniform surface polishing, and low defect density, meeting the strict requirements for high-performance glass

Quality OEM Polishing Ceo2 Powder For Automotive Windshields Cas 1306-38-3 factory

OEM Polishing Ceo2 Powder For Automotive Windshields Cas 1306-38-3

Polishing Powder For Automotive Glass And Windshields Description Lichen Cerium Oxide Polishing Powder for Automotive Glass and Windshields is a high-purity, fine-grade polishing material designed to deliver superior results in the automotive glass industry. Engineered for precision finishing, this cerium oxide polishing powder ensures high-quality surface smoothness, gloss, and clarity, making it ideal for polishing automotive glass, windshields, and other critical glass

Quality Tailored Glass Polishing Paste Powder 3 Micron For Silicon Wafer factory

Tailored Glass Polishing Paste Powder 3 Micron For Silicon Wafer

Tailored Polishing Powder For Silicon Wafer Manufacturing Description Lichen Tailored Polishing Powder for Silicon Wafer Manufacturing is a premium cerium oxide-based powder formulated to deliver exceptional performance in the polishing of silicon wafers used in semiconductor manufacturing. Designed to meet the stringent requirements of the semiconductor industry, this powder offers unparalleled control over the material removal rate, surface flatness, and defect reduction,

Quality Semiconductor CeO2 Ceria Slurry Cerium Based Glass Polishing Powder factory

Semiconductor CeO2 Ceria Slurry Cerium Based Glass Polishing Powder

Custom Polishing Powder for High-Purity Semiconductor Wafers Description Lichen Polishing Powder for Ultra-Flat Semiconductor Surface Finishing is a high-performance cerium oxide-based polishing powder designed to achieve exceptionally flat and smooth surfaces required for advanced semiconductor manufacturing. Whether polishing silicon wafers or compound semiconductors, our powder ensures ultra-flat surfaces with low roughness and uniform thickness, making it ideal for high

Quality Water Based CeO2 Chemical Mechanical Polishing Slurry For Glass Defect Removal factory

Water Based CeO2 Chemical Mechanical Polishing Slurry For Glass Defect Removal

Polishing Slurry For Float Glass Surface Defect RemovalDescriptionLichen Polishing Slurry for Float Glass Surface Defect Removal is a cerium oxide-based slurry specifically formulated to effectively remove surface defects from float glass. Whether addressing scratches, water spots, haze, or micro-defects, our slurry delivers superior material removal rates and enhances surface clarity, making it ideal for both manufacturing and post-production glass surface restoration

Quality OEM Cerium Oxide Glass Powder Polish Slurry Powder For Semiconductor Windshield factory

OEM Cerium Oxide Glass Powder Polish Slurry Powder For Semiconductor Windshield

High Purity Cerium Oxide Slurry for Semiconductor Description Deliver atomic-level planarity for the most demanding 2026 semiconductor nodes with our High-Purity Cerium Oxide (Ceria) Slurries. Specifically engineered for Chemical Mechanical Planarization (CMP). Atomic-Scale Planarization: Achieve superior surface finishes with root-mean-square (RMS) roughness below 0.2 nm, essential for the ultra-fine geometries of next-generation integrated circuits. Integrated Self-Stopping

Quality Scratch Free Lapping Slurry Cerium Oxide Abrasive For Smartphone Camera Lenses factory

Scratch Free Lapping Slurry Cerium Oxide Abrasive For Smartphone Camera Lenses

Scratch-free Cerium Oxide Slurry For Smartphone Camera Lenses Description Our Scratch-free Cerium Oxide Slurry is specially formulated to deliver premium polishing performance for smartphone camera lenses. Designed to provide superior surface quality while preventing surface damage, this cerium oxide slurry is ideal for achieving high-precision finishes on optical lenses, ensuring clarity, scratch resistance, and minimal distortion in high-quality smartphone cameras. Key

Quality Polishing Cerium Oxide Compound Ceo2 Slurry For Chemically Strengthened Glass factory

Polishing Cerium Oxide Compound Ceo2 Slurry For Chemically Strengthened Glass

Polishing Slurry For Chemically Strengthened Glass Description Lichen Cerium-Based Polishing Slurry for Chemically Strengthened Glass is a high-purity, ready-to-use slurry specifically formulated for the fine polishing and surface finishing of chemically strengthened glass. Designed to work effectively on glass that has undergone ion-exchange strengthening processes, this slurry delivers excellent surface smoothness, high gloss, and low defect density without compromising the