High-purity Nano Ceria CMP Slurry (200nm Particle Size) Designed For Semiconductor
Product Details
| D50: | 200nm | Agglomeration: | Extremely Low |
|---|---|---|---|
| CeO₂: | 99% | Solid Content: | 20 Wt% |
| PH Range: | 6.5 – 8.5 | Appearance: | White |
| Highlight |
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Product Description
High-purity Nano Ceria CMP Slurry (200nm Particle Size) Designed For Semiconductor
Description
High-purity nano ceria CMP slurry (100nm particle size) designed for semiconductor and advanced surface finishing. Stable dispersion, high removal rate, and ultra-low surface defects.
It is ideal for next-generation precision polishing processes demanding nanometer-level surface control.
Key Features & Advantages
Nano-Scale Precision Polishing
The 100 nm ceria particles enable controlled material removal at the nanometer level, making the slurry suitable for advanced CMP processes requiring ultra-smooth surfaces.
High Removal Rate with Low Defects
Optimized chemical activity of cerium oxide provides efficient polishing while minimizing scratches, pits, and residual defects.
Excellent Dispersion Stability
Positive zeta potential design ensures long-term slurry stability, preventing particle agglomeration during storage and operation.
Superior Surface Quality
Achieves mirror-grade surface finishes with extremely low roughness (Ra), improving downstream coating, lithography, and device performance.
Process Compatibility
Compatible with major CMP platforms, polishing pads, and automated slurry delivery systems.
Particle Size Distribution
Q&A
1. What is rare earth polishing powder?
Rare earth polishing powder is a high-purity compound used for polishing optical components, semiconductor wafers, and delicate surfaces like glass and lenses. It delivers a smooth, high-clarity finish without damaging the material.
2. How do I choose the right rare earth polishing powder for my application?
To select the ideal polishing powder, consider factors like the material you’re polishing, the required finish, and specifications like particle size and purity. Our sales team is available to help you choose the perfect product for your needs.
3. How should I store rare earth polishing powder?
Store in a cool, dry place, away from moisture and direct sunlight. Keep the powder in airtight containers to prevent contamination and maintain its effectiveness. With proper storage, it typically lasts 1-2 years.
4. Do you provide customized rare earth formulations?
Yes, we offer custom rare earth polishing powders and slurries, tailored to meet your specific needs, including adjustments to particle size, chemical composition, or slurry consistency.
5. Can I get a sample before making a bulk order?
Absolutely! We provide samples for evaluation. Contact our team to request a sample, and we’ll arrange the shipment.
6. How can I place an order? What is the typical delivery time?
To place an order, simply contact our sales team, who will guide you through the process and provide a quote. Delivery times vary based on order size, location, and stock availability, and we’ll give you an estimated schedule once the order is confirmed.
Product Highlights
High-purity Nano Ceria CMP Slurry (200nm Particle Size) Designed For Semiconductor Description High-purity nano ceria CMP slurry (100nm particle size) designed for semiconductor and advanced surface finishing. Stable dispersion, high removal rate, and ultra-low surface defects. It is ideal for next...
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Cerium Oxalate Powder Chemical Reagent Elements
Cerium oxalate is an oxalate salt of trivalent cerium and an important rare earth compound, often existing in the form of hydrate. 1. Basic Information English Name: Cerium(III) oxalate, Cerous oxalate Chemical Formula: (usually hydrate, where x is mostly 9 or 10) Molecular Weight (Anhydrous): 544.29 : Anhydrous: 139-42-4 Hydrate: 15750-47-7 2. Physical and Chemical Properties Appearance: White or pale yellow crystalline powder, odorless and tasteless. Solubility: Practically
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