"cerium oxide powder for coatings"
紫外線保護金属 CMP セリウムオキシドスラム プレコーティング ガラスポーリング
Cerium Oxide Slurry For Pre-coating Glass Polishing Description Lichen Cerium Oxide Slurry for Pre-Coating Glass Polishing is a high-performance, cerium oxide-based slurry designed specifically for pre-coating glass polishing. Ideal for use in the glass manufacturing and coating industries, this slurry ensures a smooth, defect-free surface that is essential for optimal adhesion and uniformity of glass coatings. Whether you are working with automotive glass, architectural
Cerium Oxide Metal CMP エレクトロニクス用稀土磨きスラム ガラス 環境に優しい
Polishing Slurry for Consumer Electronics Glass Overview: Our Polishing Slurry for Consumer Electronics Glass is expertly formulated to deliver pristine, high-quality finishes on glass surfaces used in a wide range of consumer electronics. With its advanced cerium oxide composition, this slurry ensures ultra-smooth surfaces that enhance the clarity, durability, and appearance of glass used in smartphones, tablets, wearables, and other electronic devices. Key Features: High
高精度サファイア光学磨き粉 CAS 1306-38-3 OEM
Cerium Oxide Polishing Powder for Electronics Components Overview: Our Polishing Powder for Optical Surface Finishing is expertly designed to deliver flawless, high-precision finishes for optical components. Formulated with premium cerium oxide, this powder provides exceptional performance in polishing delicate optical surfaces, ensuring the highest levels of clarity, smoothness, and accuracy. Whether you're working with lenses, mirrors, prisms, or other optical devices, our
CeF3セリウムフッ化水晶 高純度99.99% 光学コーティング用
CeF3 Crystal Cerium Fluoride High Purity 99.99% for Optical Coating or Suxiliary Solvent Molecular Formula: CeF₃ Appearance: Cerium fluoride is a white powder Application: Used as high-purity chemical and coating material Item Specification Testing Standard I tem CeF 3 -3N5 CeF 3 -4N CeF 3 -4N5 CeF 3 -5N TREO(wt%) ≥80 ≥80 ≥80 ≥80 Rare Earth Relative Purity (wt%) La 2 O 3 /TREO ≤0.01 ≤0.005 ≤0.003 ≤0.0004 GB/T 18115.2 CeO 2 /TREO ≥99.95 ≥99.99 ≥99.995 ≥99.999 Pr 6 O 11 /TREO
レイチェ 稀有地物質 元素 鉱物 ランタン セリウム 金属
Lanthanum-Cerium Metal (Misch Metal) Lanthanum-Cerium Metal is a mixed rare earth metal alloy composed mainly of lanthanum (La) and cerium (Ce), also known as Misch Metal in industry. It is one of the most widely used rare earth raw materials. 1. Basic Information Chinese Name: Lanthanum-Cerium Metal, Mixed Rare Earth Metal English Name: Lanthanum-Cerium Master Alloy, Misch Metal Chemical Formula: Ce-La (typical ratio La:Ce ≈ 35:65) CAS No.: 62379-61-7 Molecular Weight:
水ベースのCeO2 化学機械的な磨きスラム ガラスの欠陥除去
Polishing Slurry For Float Glass Surface Defect RemovalDescriptionLichen Polishing Slurry for Float Glass Surface Defect Removal is a cerium oxide-based slurry specifically formulated to effectively remove surface defects from float glass. Whether addressing scratches, water spots, haze, or micro-defects, our slurry delivers superior material removal rates and enhances surface clarity, making it ideal for both manufacturing and post-production glass surface restoration
0.2μm 展示用ガラス清掃用稀土磨きスラム CAS 1306-38-3
Polishing Slurry for Display Glass Cleaning Description Maintain peak production yields and pristine optical clarity with our Series Cerium Oxide (CeO₂) Cleaning Slurries. Specifically engineered for the global display industry, these slurries are designed for the high-speed cleaning, light defect removal, and surface preparation of LCD, OLED, and Touchscreen glass. Unlike standard polishing abrasives, our cleaning formulations focus on surface activation and the removal of
2.2μM Ph 中性ポリシング CMP グラス・ウェーファー基板用スラム
CMP Slurry For Glass Wafer Substrates Description Lichen CMP Slurry for Glass Wafer Substrates is a high-purity, ready-to-use polishing slurry formulated for precision chemical-mechanical planarization (CMP) of glass wafer substrates. Designed for the advanced semiconductor, photonics, and microelectronics industries, this slurry ensures optimal material removal, uniform surface polishing, and low defect density, meeting the strict requirements for high-performance glass
半導体向け高純度ナノセリアCMPスラリー（粒子径200nm）
High-purity Nano Ceria CMP Slurry (200nm Particle Size) Designed For Semiconductor Descripti on High-purity nano ceria CMP slurry (100nm particle size) designed for semiconductor and advanced surface finishing. Stable dispersion, high removal rate, and ultra-low surface defects. It is ideal for next-generation precision polishing processes demanding nanometer-level surface control. Key Features & Advantages Nano-Scale Precision Polishing The 100 nm ceria particles enable
