"cerium rare earth oxide"
高純度ポリシング Ceo2 パウダースラー OLEDディスプレイ
High Purity Polishing Slurry For OLED DisplaysDescriptionLichen High-Purity Polishing Slurry for OLED Displays is an advanced cerium oxide-based slurry designed to meet the demanding requirements of OLED display production. Engineered for ultra-smooth finishes, our slurry provides exceptional surface quality, critical for OLED panels, ensuring high optical performance, color accuracy, and long-term reliability.Our slurry is ideal for polishing the glass substrates and fine
シリコン・ウェーバーのための3ミクロン製のグラス・ポーリング・ペスト粉末
Tailored Polishing Powder For Silicon Wafer Manufacturing Description Lichen Tailored Polishing Powder for Silicon Wafer Manufacturing is a premium cerium oxide-based powder formulated to deliver exceptional performance in the polishing of silicon wafers used in semiconductor manufacturing. Designed to meet the stringent requirements of the semiconductor industry, this powder offers unparalleled control over the material removal rate, surface flatness, and defect reduction,
水ベースのCeO2 化学機械的な磨きスラム ガラスの欠陥除去
Polishing Slurry For Float Glass Surface Defect RemovalDescriptionLichen Polishing Slurry for Float Glass Surface Defect Removal is a cerium oxide-based slurry specifically formulated to effectively remove surface defects from float glass. Whether addressing scratches, water spots, haze, or micro-defects, our slurry delivers superior material removal rates and enhances surface clarity, making it ideal for both manufacturing and post-production glass surface restoration
カスタマイズされた化学機械磨き CMPスラリーサブナノメートルのLCDパネル
Customized Polishing Slurry for LCD Panel Manufacturing Description Engineered for the stringent demands of display technologies, our customized cerium oxide slurries provide the high-precision finishing required for high-generation LCD and liquid crystal glass substrates. As automotive and consumer electronics move toward ultra-thin and curved profiles, our slurries deliver the sub-nanometer flatness and surface integrity essential for uniform light transmission. Core
2.2μM Ph 中性ポリシング CMP グラス・ウェーファー基板用スラム
CMP Slurry For Glass Wafer Substrates Description Lichen CMP Slurry for Glass Wafer Substrates is a high-purity, ready-to-use polishing slurry formulated for precision chemical-mechanical planarization (CMP) of glass wafer substrates. Designed for the advanced semiconductor, photonics, and microelectronics industries, this slurry ensures optimal material removal, uniform surface polishing, and low defect density, meeting the strict requirements for high-performance glass
半導体向け高純度ナノセリアCMPスラリー（粒子径200nm）
High-purity Nano Ceria CMP Slurry (200nm Particle Size) Designed For Semiconductor Descripti on High-purity nano ceria CMP slurry (100nm particle size) designed for semiconductor and advanced surface finishing. Stable dispersion, high removal rate, and ultra-low surface defects. It is ideal for next-generation precision polishing processes demanding nanometer-level surface control. Key Features & Advantages Nano-Scale Precision Polishing The 100 nm ceria particles enable
