High-Purity Cerium Oxide Polishing Powder for Precision Optical Components
جزئیات محصول
| خلوص: | ≥ 99.9٪ | D50: | 0.8 - 1.2 میکرومتر |
|---|---|---|---|
| توزیع اندازه ذرات: | محدود، تنگ | pH (15% سوسپانسیون): | 6.5 - 8.5 |
| ظاهر: | پودر زرد روشن | پایداری پراکندگی: | بالا |
| برجسته کردن |
cerium oxide polishing powder,high-purity optical polishing compound,rare earth precision polishing powder,high-purity optical polishing compound,rare earth precision polishing powder |
||
توضیحات محصول
High-Purity Cerium Oxide Polishing Powder for Precision Optical Components
Product Overview
High-Purity Cerium Oxide Polishing Powder is engineered for ultra-precision surface finishing of advanced optical components. Designed for high surface quality requirements, this polishing agent delivers excellent chemical-mechanical interaction, enabling superior defect control, high polishing efficiency, and stable performance in demanding optical manufacturing environments.
The product is suitable for batch and automated polishing systems used in modern optical fabrication.
Key Features
- High chemical activity for efficient material removal
- Excellent scratch-free polishing performance
- Narrow particle size distribution for surface uniformity
- Low defect generation and stable polishing behavior
- Compatible with pitch, polyurethane, and composite polishing pads
- Optimized for precision optical manufacturing processes
Particle Size Distribution
Applications
- Precision optical lenses polishing
- Camera and imaging optics
- Optical glass finishing
- Telescope optics manufacturing
- Prism and mirror polishing
- High-end photonics components
Frequently Asked Questions
Q1: What surface quality can be achieved?
Surface roughness below Ra 1 nm can be achieved depending on process conditions.
Q2: Can the powder be converted into slurry?
Yes. The powder disperses easily into deionized water to prepare customized polishing slurry.
Q3: Is it suitable for automated polishing machines?
Yes, it is optimized for both manual and CNC optical polishing systems.
نکات برجسته محصول
High-Purity Cerium Oxide Polishing Powder for Precision Optical Components Product Overview High-Purity Cerium Oxide Polishing Powder is engineered for ultra-precision surface finishing of advanced optical components. Designed for high surface quality requirements, this polishing agent delivers ...
High-Removal-Rate Cerium Oxide Polishing Powder for Optical Manufacturing Efficiency
High-Removal-Rate Cerium Oxide Polishing Powder for Optical Manufacturing Efficiency Product Overview High-Removal-Rate Cerium Oxide Polishing Powder is designed for production environments requiring high throughput without sacrificing optical surface quality. The optimized particle structure enhances polishing efficiency while maintaining controlled surface finishing performance. It supports cost-effective large-scale optical component manufacturing. Key Features High
High-Purity Cerium Oxide Polishing Powder for Precision Optical Components
High-Purity Cerium Oxide Polishing Powder for Precision Optical Components Product Overview High-Purity Cerium Oxide Polishing Powder is engineered for ultra-precision surface finishing of advanced optical components. Designed for high surface quality requirements, this polishing agent delivers excellent chemical-mechanical interaction, enabling superior defect control, high polishing efficiency, and stable performance in demanding optical manufacturing environments. The
Ultra-Fine Ceria Polishing Powder for Laser Crystal and Photonics Applications
Ultra-Fine Ceria Polishing Powder for Laser Crystal and Photonics Applications Product Overview Ultra-Fine Ceria Polishing Powder is developed for polishing laser crystals and advanced photonic materials requiring ultra-low subsurface damage and exceptional surface smoothness. The formulation balances mechanical abrasion and chemical reactivity to achieve controlled polishing with minimized micro-scratches. It is ideal for high-value optical substrates used in laser and
پودر پولیش اکسید سریم گرید نیمههادی برای ویفر و زیرلایههای پیشرفته
Semiconductor Grade Cerium Oxide Polishing Powder for Wafer & Advanced Substrates Product Overview Semiconductor Grade Cerium Oxide Polishing Powder is formulated for defect-sensitive polishing applications in semiconductor and advanced electronic substrate manufacturing. The controlled purity and particle engineering reduce contamination risks while ensuring consistent planarization performance. Optimized for preparation of CMP slurries used in semiconductor wafer processing
لطفا از فرم تماس آنلاین در زیر استفاده کنید اگر سوالی دارید، تیم ما در اسرع وقت با شما تماس خواهد گرفت.
