Quality Aluminum Oxide (Al₂O₃) CMP Slurry For Wafer Planarization & Precision Semiconductor Polishing factory
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Quality Aluminum Oxide (Al₂O₃) CMP Slurry For Wafer Planarization & Precision Semiconductor Polishing factory
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Aluminum Oxide (Al₂O₃) CMP Slurry For Wafer Planarization & Precision Semiconductor Polishing

Brand Name: LICHEN
Model Number: LC
Place of Origin: CHINA
Certification: ISO9001
Minimum Order Quantity: 20KGS
Price: Contact us
Supply Ability: 3000MT/YEAR

Product Details


D50: Customizable PH: Customizable
Solid Content: Customizable Particle Distribution: Narrow PSD
Dispersion Stability: Excellent Defect Performance: Low Scratch Rate
Highlight

Aluminum Oxide CMP slurry for wafer planarization

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Al₂O₃ semiconductor polishing slurry

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Precision CMP slurry for semiconductor wafers

Product Description

Aluminum Oxide (Al₂O₃) CMP Slurry For Wafer Planarization & Precision Semiconductor Polishing

Overview:

Alumina CMP Slurry (Aluminum Oxide CMP Slurry) is a high-performance chemical mechanical planarization material developed for precision surface planarization in semiconductor manufacturing and advanced electronic fabrication.

Formulated using high-purity aluminum oxide abrasive particles and optimized chemical additives, the slurry provides controlled material removal while maintaining excellent surface flatness and low defect generation. The carefully engineered particle size distribution ensures uniform polishing performance and stable process control during CMP operations.

Designed for modern semiconductor nodes and high-volume manufacturing environments, the alumina CMP slurry supports consistent wafer planarization, improved yield performance, and reliable integration into automated CMP equipment.

 

Key Features & Advantages

Excellent Planarization Performance

Provides uniform material removal and superior surface flatness required in semiconductor fabrication.

Controlled Removal Rate

Optimized abrasive and chemical balance enables precise polishing control for different wafer materials.

Low Defect Generation

High dispersion stability minimizes particle agglomeration, reducing scratches and defects.

Stable CMP Operation

Maintains consistent slurry performance during long polishing cycles and automated production.

High Process Compatibility

Suitable for various CMP platforms and polishing pad systems.


Particle Size Distribution

Aluminum Oxide (Al₂O₃) CMP Slurry For Wafer Planarization & Precision Semiconductor Polishing 0

Typical Applications

Semiconductor Manufacturing

  • Silicon wafer CMP
  • Oxide layer planarization
  • Metal layer polishing
  • Interlayer dielectric polishing

Technical Advantages of Alumina CMP Slurry

Alumina abrasives provide:

  • Strong mechanical polishing capability
  • Stable chemical properties
  • Wide process adaptability
  • Cost-effective CMP performance
  • Reliable removal rate control

Compared with softer abrasives, alumina CMP slurry is particularly effective for applications requiring efficient planarization and robust process stability.


Q&A

1. Can I get a sample before making a bulk order?

Absolutely! We provide samples for evaluation. Contact our team to request a sample, and we’ll arrange the shipment.

2. How can I place an order? What is the typical delivery time?

To place an order, simply contact our sales team, who will guide you through the process and provide a quote. Delivery times vary based on order size, location, and stock availability, and we’ll give you an estimated schedule once the order is confirmed.

Product Highlights

Aluminum Oxide (Al₂O₃) CMP Slurry For Wafer Planarization & Precision Semiconductor Polishing Overview: Alumina CMP Slurry (Aluminum Oxide CMP Slurry) is a high-performance chemical mechanical planarization material developed for precision surface planarization in semiconductor manufacturing and ...

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