Cerium Oxide Polishing Powder for Ceramic Substrate Precision Finishing
Product Details
| Chemical Formula: | CeO₂ | CAS No.: | 1306-38-3 |
|---|---|---|---|
| CeO₂ Purity: | ≥99% | Particle Size: | 0.5–1.4 μm |
| Appearance: | Light Yellow Powder | Packaging: | Customizable |
| Highlight |
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Product Description
Cerium Oxide Polishing Powder for Ceramic Substrate Precision Finishing
Product Overview
Advanced ceramic substrate cerium oxide polishing powder is a rare earth abrasive designed for precision finishing of alumina and ceramic substrates used in electronic packaging. Optimized particle size achieves flat, low-roughness ceramic surface without introducing micro cracks, meeting the requirement for thin film metallization on ceramic substrates.
Key Features
- Controlled particle hardness to avoid ceramic micro-cracks
- Uniform material removal rate on dense ceramic surface
- Low surface defect rate for electronic ceramic substrate
- Easy cleaning of residual abrasive after polishing
- Stable slurry performance for continuous ceramic polishing lines
Particle Size Distribution
Applications
- Alumina ceramic substrate precision finishing
- Electronic packaging ceramic component lapping
- High density advanced ceramic surface planarization
Frequently Asked Questions
Q: Is residual ceria easy to wash off ceramic surface?
A: Yes, the powder formulation allows efficient cleaning by DI water rinsing.
Q: Can we get slurry formulation suggestion?
A: Yes, we can provide reference slurry mixing ratio for ceramic polishing process.
Product Highlights
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