Cerium Oxide Polishing Powder for Quartz Crystal Wafer Precision Finishing
Product Details
| Chemical Formula: | CeO₂ | CAS No.: | 1306-38-3 |
|---|---|---|---|
| CeO₂ Purity: | ≥99% | Particle Size: | 0.4–1.1 μm |
| Appearance: | Light Yellow Powder | Packaging: | Customizable |
| Highlight |
cerium oxide polishing powder for quartz,quartz crystal wafer polishing powder,rare earth polishing powder with warranty |
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Product Description
Cerium Oxide Polishing Powder for Quartz Crystal Wafer Precision Finishing
Product Overview
Quartz crystal grade cerium oxide polishing powder is a specialized rare earth abrasive developed for precision finishing of quartz crystal wafers. Tight particle size distribution delivers consistent material removal and ultra-smooth planar surfaces, avoiding crystal subsurface damage that would interfere with resonant frequency performance. Ideal for mass production of electronic quartz components.
Key Features
- Narrow particle size distribution to prevent crystal subsurface damage
- Stable and controllable material removal rate for frequency consistency
- Minimal surface micro-defects on thin quartz wafers
- Good slurry filterability for continuous wafer polishing lines
- Low heavy metal impurities compliant with electronic manufacturing standards
Particle Size Distribution
Applications
- Quartz crystal wafer precision lapping & finishing
- Thin quartz blank surface planarization
- Electronic frequency component substrate processing
Frequently Asked Questions
Q: Can you supply small test batches for wafer trial?
A: Yes, Samples are available for process validation.
Q: Is this powder compatible with wafer polishing pads?
A: Yes, it works well with standard polishing pads for quartz wafer production.
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