"cerium rare earth oxide"
पानी आधारित CeO2 शीशियों के दोषों को दूर करने के लिए रासायनिक यांत्रिक चमकाने वाली स्लरी
Polishing Slurry For Float Glass Surface Defect RemovalDescriptionLichen Polishing Slurry for Float Glass Surface Defect Removal is a cerium oxide-based slurry specifically formulated to effectively remove surface defects from float glass. Whether addressing scratches, water spots, haze, or micro-defects, our slurry delivers superior material removal rates and enhances surface clarity, making it ideal for both manufacturing and post-production glass surface restoration
अनुकूलित रासायनिक यांत्रिक पॉलिशिंग सीएमपी स्लरी सब नैनोमीटर एलसीडी पैनल
Customized Polishing Slurry for LCD Panel Manufacturing Description Engineered for the stringent demands of display technologies, our customized cerium oxide slurries provide the high-precision finishing required for high-generation LCD and liquid crystal glass substrates. As automotive and consumer electronics move toward ultra-thin and curved profiles, our slurries deliver the sub-nanometer flatness and surface integrity essential for uniform light transmission. Core
2.2μM Ph Neutral Polishing CMP Glass Wafer Substrate के लिए स्लरी
CMP Slurry For Glass Wafer Substrates Description Lichen CMP Slurry for Glass Wafer Substrates is a high-purity, ready-to-use polishing slurry formulated for precision chemical-mechanical planarization (CMP) of glass wafer substrates. Designed for the advanced semiconductor, photonics, and microelectronics industries, this slurry ensures optimal material removal, uniform surface polishing, and low defect density, meeting the strict requirements for high-performance glass
उच्च शुद्धता वाला नैनो सेरिया सीएमपी स्लरी (200nm कण आकार) अर्धचालक के लिए डिज़ाइन किया गया
High-purity Nano Ceria CMP Slurry (200nm Particle Size) Designed For Semiconductor Descripti on High-purity nano ceria CMP slurry (100nm particle size) designed for semiconductor and advanced surface finishing. Stable dispersion, high removal rate, and ultra-low surface defects. It is ideal for next-generation precision polishing processes demanding nanometer-level surface control. Key Features & Advantages Nano-Scale Precision Polishing The 100 nm ceria particles enable
