124 Results For

"cerium rare earth oxide"

품질 물 기반의 CeO2 화학적 기계적 닦기 슬러리 유리 결함 제거 공장

물 기반의 CeO2 화학적 기계적 닦기 슬러리 유리 결함 제거

Polishing Slurry For Float Glass Surface Defect RemovalDescriptionLichen Polishing Slurry for Float Glass Surface Defect Removal is a cerium oxide-based slurry specifically formulated to effectively remove surface defects from float glass. Whether addressing scratches, water spots, haze, or micro-defects, our slurry delivers superior material removal rates and enhances surface clarity, making it ideal for both manufacturing and post-production glass surface restoration

품질 사용자 정의 화학 기계 닦기 CMP 슬러리 서브 나노미터 LCD 패널 공장

사용자 정의 화학 기계 닦기 CMP 슬러리 서브 나노미터 LCD 패널

Customized Polishing Slurry for LCD Panel Manufacturing Description Engineered for the stringent demands of display technologies, our customized cerium oxide slurries provide the high-precision finishing required for high-generation LCD and liquid crystal glass substrates. As automotive and consumer electronics move toward ultra-thin and curved profiles, our slurries deliver the sub-nanometer flatness and surface integrity essential for uniform light transmission. Core

품질 2.2μM Ph 중립 닦기 CMP 유리 웨이퍼 기판용 슬러리 공장

2.2μM Ph 중립 닦기 CMP 유리 웨이퍼 기판용 슬러리

CMP Slurry For Glass Wafer Substrates Description Lichen CMP Slurry for Glass Wafer Substrates is a high-purity, ready-to-use polishing slurry formulated for precision chemical-mechanical planarization (CMP) of glass wafer substrates. Designed for the advanced semiconductor, photonics, and microelectronics industries, this slurry ensures optimal material removal, uniform surface polishing, and low defect density, meeting the strict requirements for high-performance glass

품질 반도체용으로 설계된 고순도 나노 세리아 CMP 슬러리 (200nm 입자 크기) 공장

반도체용으로 설계된 고순도 나노 세리아 CMP 슬러리 (200nm 입자 크기)

High-purity Nano Ceria CMP Slurry (200nm Particle Size) Designed For Semiconductor Descripti on High-purity nano ceria CMP slurry (100nm particle size) designed for semiconductor and advanced surface finishing. Stable dispersion, high removal rate, and ultra-low surface defects. It is ideal for next-generation precision polishing processes demanding nanometer-level surface control. Key Features & Advantages Nano-Scale Precision Polishing The 100 nm ceria particles enable

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