124 Results For

"cerium rare earth oxide"

Kualitas CeO2 Berbasis Air Limbah Polishing Mekanis Kimia Untuk Penghapusan Cacat Kaca Pabrik

CeO2 Berbasis Air Limbah Polishing Mekanis Kimia Untuk Penghapusan Cacat Kaca

Polishing Slurry For Float Glass Surface Defect RemovalDescriptionLichen Polishing Slurry for Float Glass Surface Defect Removal is a cerium oxide-based slurry specifically formulated to effectively remove surface defects from float glass. Whether addressing scratches, water spots, haze, or micro-defects, our slurry delivers superior material removal rates and enhances surface clarity, making it ideal for both manufacturing and post-production glass surface restoration

Kualitas Panel LCD Sub Nanometer yang disesuaikan dengan Polishing Kimia Mekanis CMP Pabrik

Panel LCD Sub Nanometer yang disesuaikan dengan Polishing Kimia Mekanis CMP

Customized Polishing Slurry for LCD Panel Manufacturing Description Engineered for the stringent demands of display technologies, our customized cerium oxide slurries provide the high-precision finishing required for high-generation LCD and liquid crystal glass substrates. As automotive and consumer electronics move toward ultra-thin and curved profiles, our slurries deliver the sub-nanometer flatness and surface integrity essential for uniform light transmission. Core

Kualitas 2.2μM Ph Neutral Polishing CMP Slurry Untuk Substrat Wafer Kaca Pabrik

2.2μM Ph Neutral Polishing CMP Slurry Untuk Substrat Wafer Kaca

CMP Slurry For Glass Wafer Substrates Description Lichen CMP Slurry for Glass Wafer Substrates is a high-purity, ready-to-use polishing slurry formulated for precision chemical-mechanical planarization (CMP) of glass wafer substrates. Designed for the advanced semiconductor, photonics, and microelectronics industries, this slurry ensures optimal material removal, uniform surface polishing, and low defect density, meeting the strict requirements for high-performance glass

Kualitas Slurry CMP Nano Ceria Kemurnian Tinggi (Ukuran Partikel 200nm) Dirancang Untuk Semikonduktor Pabrik

Slurry CMP Nano Ceria Kemurnian Tinggi (Ukuran Partikel 200nm) Dirancang Untuk Semikonduktor

High-purity Nano Ceria CMP Slurry (200nm Particle Size) Designed For Semiconductor Descripti on High-purity nano ceria CMP slurry (100nm particle size) designed for semiconductor and advanced surface finishing. Stable dispersion, high removal rate, and ultra-low surface defects. It is ideal for next-generation precision polishing processes demanding nanometer-level surface control. Key Features & Advantages Nano-Scale Precision Polishing The 100 nm ceria particles enable

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