"high purity cerium oxide powder"
高品質の工業用稀土化合物 セリウム酸化物 Ceo2 ガラスの磨き粉
FACTORY PRICE INDUSTRIAL GRADE CERIUM OXIDE POWDER CAS NO 1306-38-3 CEO2 HIGH PURITY 99.99% GLASS POLISHING POWDER Cerium Oxide Molecular Formula: CeO₂ Appearance: Light yellow powder Uses: Used as polishing material or as a catalyst. Item Specifications Test Basis Item CeO 2 -3N5C CeO 2 -4NC CeO 2 -4N5C CeO 2 -5NC TREO(wt%) ≥99.0 ≥99.0 ≥99.0 ≥99.0 Rare Earth Relative Purity (wt%) La 2 O 3 /TREO ≤0.01 ≤0.005 ≤0.003 ≤0.0004 GB/T 18115.2 CeO 2 /TREO ≥99.95 ≥99.99 ≥99.995 ≥99
工業用稀土化合物 セリウムオキシド Ceo2 ガラスの磨き粉
FACTORY PRICE INDUSTRIAL GRADE CERIUM OXIDE POWDER CAS NO 1306-38-3 CEO2 HIGH PURITY 99.99% GLASS POLISHING POWDER Cerium Oxide Molecular Formula: CeO₂ Appearance: Light yellow powder Uses: Used as polishing material or as a catalyst. Item Specifications Test Basis Item CeO 2 -3N5C CeO 2 -4NC CeO 2 -4N5C CeO 2 -5NC TREO(wt%) ≥99.0 ≥99.0 ≥99.0 ≥99.0 Rare Earth Relative Purity (wt%) La 2 O 3 /TREO ≤0.01 ≤0.005 ≤0.003 ≤0.0004 GB/T 18115.2 CeO 2 /TREO ≥99.95 ≥99.99 ≥99.995 ≥99
産業用稀土化合物セリウムオキシド Ceo2 ガラスポーリングパウダーの競争価格
FACTORY PRICE INDUSTRIAL GRADE CERIUM OXIDE POWDER CAS NO 1306-38-3 CEO2 HIGH PURITY 99.99% GLASS POLISHING POWDER Cerium Oxide Molecular Formula: CeO₂ Appearance: Light yellow powder Uses: Used as polishing material or as a catalyst. Item Specifications Test Basis Item CeO 2 -3N5C CeO 2 -4NC CeO 2 -4N5C CeO 2 -5NC TREO(wt%) ≥99.0 ≥99.0 ≥99.0 ≥99.0 Rare Earth Relative Purity (wt%) La 2 O 3 /TREO ≤0.01 ≤0.005 ≤0.003 ≤0.0004 GB/T 18115.2 CeO 2 /TREO ≥99.95 ≥99.99 ≥99.995 ≥99
高性能セリウムオキシドスラム 展示表面磨き用 CAS 1306-38-3
High-Performance Cerium Slurry for Display Surface Finishing Description Achieve uncompromising optical clarity with our Precision-Engineered Cerium Oxide (CeO₂) Slurries. Specifically formulated for the display market, our slurries provide the nanometer-level flatness and defect-free surfaces essential for high-resolution LCD, OLED, and MicroLED consumer electronics. By combining high-purity rare earth oxides with advanced chemical stabilizers, our product line ensures
ウェハー＆先端基板用半導体グレード酸化セリウム研磨粉
Semiconductor Grade Cerium Oxide Polishing Powder for Wafer & Advanced Substrates Product Overview Semiconductor Grade Cerium Oxide Polishing Powder is formulated for defect-sensitive polishing applications in semiconductor and advanced electronic substrate manufacturing. The controlled purity and particle engineering reduce contamination risks while ensuring consistent planarization performance. Optimized for preparation of CMP slurries used in semiconductor wafer processing
ナノセリアCMPスラム 100nm 半導体のための高性能セリア酸化CMPスラム
Nano Ceria CMP Slurry 100nm | High-Performance Cerium Oxide CMP Slurry For Semiconductor Descripti on Nano Ceria CMP Slurry (100 nm) is a high-performance chemical mechanical polishing (CMP) material formulated using ultra-fine nanometer cerium oxide particles. The slurry is engineered for high-precision planarization, defect control, and superior surface quality required in semiconductor manufacturing. Through optimized particle size distribution and controlled surface
CeF3セリウムフッ化水晶 高純度99.99% 光学コーティング用
CeF3 Crystal Cerium Fluoride High Purity 99.99% for Optical Coating or Suxiliary Solvent Molecular Formula: CeF₃ Appearance: Cerium fluoride is a white powder Application: Used as high-purity chemical and coating material Item Specification Testing Standard I tem CeF 3 -3N5 CeF 3 -4N CeF 3 -4N5 CeF 3 -5N TREO(wt%) ≥80 ≥80 ≥80 ≥80 Rare Earth Relative Purity (wt%) La 2 O 3 /TREO ≤0.01 ≤0.005 ≤0.003 ≤0.0004 GB/T 18115.2 CeO 2 /TREO ≥99.95 ≥99.99 ≥99.995 ≥99.999 Pr 6 O 11 /TREO
光学ガラスの擦り取り除去剤を磨く 粉末 防風ガラスのためのセリウム酸化物
Polishing Powder for Optical Glass Manufacturing Description Lichen Polishing Powder for Optical Glass Manufacturing is a premium-grade optical polishing material engineered to deliver consistent material removal, excellent surface smoothness, and stable process performance across a wide range of optical glass types. Formulated using high-purity abrasives with controlled particle size distribution, this polishing powder supports the demanding requirements of precision optics
1.2μmセリウムオキシド 自動車ガラスのフロントガラスのための稀土の磨き粉
Polishing Powder For Automotive Glass Finishing Description Lichen Polishing Powder for Automotive Glass Finishing is a premium-grade abrasive designed specifically for automotive windshields, side windows, and sunroofs. Engineered for efficient material removal and smooth surface finishing, this polishing powder ensures scratch-free, optically clear glass surfaces that meet the rigorous standards of the automotive industry. With controlled particle size distribution and
ISO9001 レーザー光学ガラスのためのセリウム酸化光学磨き粉末材料
Polishing Materials for Laser Optics Description Our Polishing Materials for Laser Optics are specially formulated to meet the stringent requirements of laser optic fabrication, ensuring superior surface quality and performance. Designed for high-precision components such as laser mirrors, lenses, beam-splitters, and prisms, these materials provide unmatched finish quality essential for laser applications. Key Features: High Precision Abrasive: Achieves ultra-smooth surfaces
高純度セリウムヒドロキシード 希少土粉 原材料
Cerium Hydroxide Molecular Formula: Ce(OH)₄ Appearance: Cerium hydroxide is a pale yellow powder Application: Used as a clarifying and decolorizing agent in the glass industry, and as a raw material for the production of high-cerium compounds. Item Specification Testing Standard Item Ce(OH)4-3N5 Ce(OH)4-4N Ce(OH)4-4N5 Ce(OH)4-5N TREO(wt%) 55.0～70.0 55.0～70.0 55.0～70.0 55.0～70.0 Rare Earth Relative Purity (wt%) La2O3/TREO ≤0.01 ≤0.005 ≤0.003 ≤0.0004 GB/T 18115.2 CeO2/TREO ≥99
自動車用触媒コンバーターのためのセリウム酸化物触媒 高純度セオ2酸素貯蔵材料
Cerium Oxide Catalyst For Automotive Catalytic Converters | High-Purity CeO₂ Oxygen Storage Material Description High-purity cerium oxide used as an oxygen storage catalyst material in automotive catalytic converters. Enhances emission control efficiency, thermal stability, and catalyst durability. Key Features High Oxygen Storage Capacity Cerium oxide efficiently stores and releases oxygen, maintaining optimal catalytic activity under dynamic engine conditions. Enhanced
