"high purity cerium oxide powder"
CMPセリウムオキシド 稀土の磨きスラープーダー シリコン・ウェーファー オーダーメイド
Cerium Oxide CMP Polishing Slurry for Silicon Wafer Description Achieve atomic-level planarity and superior device yields with our Series Cerium Oxide (CeO₂) CMP Slurries. Specifically engineered for the most demanding Chemical Mechanical Planarization (CMP) processes in semiconductor fabrication. In 2026, as wafer geometries become increasingly complex, our ceria-based formulations provide the high selectivity and ultra-low defectivity. Performance Excellence High Selectivit
セリウムオキシド球状触媒粉末磨き材料
HIGH SPECIFIC SURFACE AREA CERIUM OXIDE SPHERICAL POWDER FOR CERIUM-BASED CATALYSTS Cerium Oxide Molecular Formula: CeO₂ Appearance: Light yellow powder Uses: Used as polishing material or as a catalyst. Item Specifications Test Method Item CeO2-3N5C CeO2-4NC CeO2-4N5C CeO2-5NC TREO(wt%) ≥99.0 ≥99.0 ≥99.0 ≥99.0 Rare Earth Relative Purity (wt%) La2O3/TREO ≤0.01 ≤0.005 ≤0.003 ≤0.0004 GB/T 18115.2 CeO2/TREO ≥99.95 ≥99.99 ≥99.995 ≥99.999 Pr6O11/TREO ≤0.01 ≤0.002 ≤0.001 ≤0.0002
1.1μmセリウム酸化物 石の光学を磨くための摩擦化合物粉
Fine Particle Polishing Powder for Optics Description Achieve uncompromising surface quality with our Fine Particle Cerium Oxide Polishing Powders. Specifically engineered for advanced optical manufacturing standards. By combining tightly controlled particle morphology with optimized chemical reactivity, our powders deliver a superior Chemical-Mechanical Polishing (CMP) action that ensures rapid material removal while maintaining an ultra-low scatter, pit-free finish. Key
スクラッチリモバー ジルコニア ガラス ポーリング 粉 セリウムオキシド スラム ODM
Cerium oxide slurry for micro-scratch removal on display glass Description Particle Size: The powder typically features an ultra-fine, uniform particle size distribution, which is essential for achieving the extremely low surface roughness required for clear displays. Mechanism: The powder works through a synergistic chemical and mechanical process to smooth out imperfections like fine scratches, haziness, water spots, and sanding marks. Compatibility: It is safe for use on a
化学 機械 セリウムオキシド 磨き スラム 光ファイバー用 粉末ガラス
Polishing Slurry for Optical Fiber Manufacturing Description Cerium-based polishing slurries are an industry standard in optical fiber manufacturing for achieving the required ultra-smooth, low-defect end-face finishes on fiber optic connectors. They work through a chemical-mechanical action to ensure minimal signal loss and low back reflection in high-speed communication systems. Product Overview Cerium oxide slurries are aqueous suspensions of high-purity, micron or sub
半導体向け高純度ナノセリアCMPスラリー（粒子径200nm）
High-purity Nano Ceria CMP Slurry (200nm Particle Size) Designed For Semiconductor Descripti on High-purity nano ceria CMP slurry (100nm particle size) designed for semiconductor and advanced surface finishing. Stable dispersion, high removal rate, and ultra-low surface defects. It is ideal for next-generation precision polishing processes demanding nanometer-level surface control. Key Features & Advantages Nano-Scale Precision Polishing The 100 nm ceria particles enable
白色稀土酸化セリウム粉 石油添加物 磨き化合物
Chinese Supply High-Quality Spot White Cerium Oxide Powder petroleum additives Cerium Oxide (White) Molecular Formula: CeO₂Appearance: White powderApplication: Used as polishing material or other catalysts Item GradeSpecification CeO₂-3N5A CeO₂-4NA CeO₂-4N5A CeO₂-5NA Test Basis TREO (wt%) ≥99.0 ≥99.0 ≥99.0 ≥99.0 Rare Earth Relative Purity (wt%) La₂O₃/TREO ≤0.01 ≤0.005 ≤0.003 ≤0.0004 GB/T 18115.2 CeO₂/TREO ≥99.95 ≥99.99 ≥99.995 ≥99.999 Pr₆O₁₁/TREO ≤0.01 ≤0.002 ≤0.001 ≤0.0002
セリアムオキシドセリア フォトマスク用風車ガラス磨き粉 空白宝石2.0μm
Low-defect Cerium Oxide For Photomask Blank Polishing Description Our Low-defect Cerium Oxide is specifically formulated for the precision polishing of photomask blanks in semiconductor manufacturing. With a focus on minimizing defects and ensuring a flawless finish, this high-performance cerium oxide is ideal for photomask applications where surface quality is critical. Offering exceptional polishing efficiency and surface integrity, our cerium oxide ensures the highest
オキシドセリウム化合物 粘土 光学ガラス基板のための磨材
Cerium Oxide Slurry For Glass Substrates Description Our Cerium Oxide Slurry for Glass Substrates is engineered for high-precision polishing of a wide range of glass materials. Formulated with high-purity cerium oxide and a stable dispersion system, this slurry delivers excellent surface smoothness, controlled material removal, and low defect generation. It is ideal for applications requiring optical-grade finishes and high production consistency. Key Features High Purity
紫外線保護金属 CMP セリウムオキシドスラム プレコーティング ガラスポーリング
Cerium Oxide Slurry For Pre-coating Glass Polishing Description Lichen Cerium Oxide Slurry for Pre-Coating Glass Polishing is a high-performance, cerium oxide-based slurry designed specifically for pre-coating glass polishing. Ideal for use in the glass manufacturing and coating industries, this slurry ensures a smooth, defect-free surface that is essential for optimal adhesion and uniformity of glass coatings. Whether you are working with automotive glass, architectural
ホワイトセリウムオキシド 光子結晶基板のための稀土の磨き粉末ペスト
Cerium Oxide Polishing Powder For Photonic Crystal Substrates Description Lichen Cerium Oxide Polishing Powder for Photonic Crystal Substrates is a high-purity cerium-based polishing material engineered for the ultra-fine finishing of photonic crystal substrates. Designed to support the stringent surface quality and dimensional accuracy required in photonic crystal structures, this product enables controlled material removal while preserving delicate micro- and nano-scale
Cerium Oxide Metal CMP エレクトロニクス用稀土磨きスラム ガラス 環境に優しい
Polishing Slurry for Consumer Electronics Glass Overview: Our Polishing Slurry for Consumer Electronics Glass is expertly formulated to deliver pristine, high-quality finishes on glass surfaces used in a wide range of consumer electronics. With its advanced cerium oxide composition, this slurry ensures ultra-smooth surfaces that enhance the clarity, durability, and appearance of glass used in smartphones, tablets, wearables, and other electronic devices. Key Features: High
