품질 Customized Cerium Polishing Powder Paste For Semiconductor Wafer Polishing 공장
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품질 Customized Cerium Polishing Powder Paste For Semiconductor Wafer Polishing 공장
품질 Customized Cerium Polishing Powder Paste For Semiconductor Wafer Polishing 공장
>

Customized Cerium Polishing Powder Paste For Semiconductor Wafer Polishing

브랜드 이름: LICHEN
모델 번호: LCR0230
원산지: 중국
인증: ISO9001
최소 주문 수량: 20KGS
가격: NEGOCIABLE
공급 능력: 250MT/월

제품 상세정보


입자 크기: 3.0±0.2μm CAS 번호: 1306-38-3
CEO₂: 99% 정지율: 높은
Ph 범위: 7-10 공식화: 맞춤형
강조하다

Customized cerium polishing powder

,

semiconductor cerium polishing powder

,

semiconductor cerium oxide paste

제품 설명

Polishing Powder For Ultra-Fine Wafer Polishing

Description

Lichen Cerium-Based Polishing Slurry for Fine Planarization of Semiconductor Glass is a high-purity, ready-to-use slurry engineered for advanced glass planarization processes in semiconductor manufacturing. Formulated with precisely controlled cerium oxide particles, this slurry delivers excellent surface flatness, low roughness, and minimal defect generation, meeting the stringent requirements of modern semiconductor and microelectronics production.

It is suitable for polishing a wide range of semiconductor glass substrates, including carrier glass, interposer glass, and display-related semiconductor glass components.

 

Key Features & Advantages

High-Purity Cerium Oxide Abrasives

Low metal impurity levels help prevent contamination in sensitive semiconductor processes.

Excellent Planarization Capability

Enables uniform material removal and superior flatness across large-area glass substrates.

Low Surface Roughness

Achieves ultra-smooth surfaces required for subsequent lithography, bonding, or coating steps.

Stable Slurry Dispersion

Optimized formulation ensures minimal particle agglomeration and consistent polishing behavior.

Low Defect Density

Effectively reduces scratches, pits, and particle-related defects during fine planarization.

 

Tech Data

Molecular Formula CAS No. CeO₂ %  D50 (μm) Appearance Application
CeO2 1306-38-3 99% 3.0±0.2μm White Powder Wafer Polishing

 

Particle Size Distribution

Customized Cerium Polishing Powder Paste For Semiconductor Wafer Polishing 0

Q&A

1. What is rare earth polishing powder?

Rare earth polishing powder is a high-purity compound used for polishing optical components, semiconductor wafers, and delicate surfaces like glass and lenses. It delivers a smooth, high-clarity finish without damaging the material.

2. How do I choose the right rare earth polishing powder for my application?

To select the ideal polishing powder, consider factors like the material you’re polishing, the required finish, and specifications like particle size and purity. Our sales team is available to help you choose the perfect product for your needs.

3. How should I store  rare earth polishing powder?

Store in a cool, dry place, away from moisture and direct sunlight. Keep the powder in airtight containers to prevent contamination and maintain its effectiveness. With proper storage, it typically lasts 1-2 years.

4. Do you provide customized rare earth formulations?

Yes, we offer custom rare earth polishing powders and slurries, tailored to meet your specific needs, including adjustments to particle size, chemical composition, or slurry consistency.

5. Can I get a sample before making a bulk order?

Absolutely! We provide samples for evaluation. Contact our team to request a sample, and we’ll arrange the shipment.

6. How can I place an order? What is the typical delivery time?

To place an order, simply contact our sales team, who will guide you through the process and provide a quote. Delivery times vary based on order size, location, and stock availability, and we’ll give you an estimated schedule once the order is confirmed.

제품 하이라이트

Polishing Powder For Ultra-Fine Wafer Polishing Description Lichen Cerium-Based Polishing Slurry for Fine Planarization of Semiconductor Glass is a high-purity, ready-to-use slurry engineered for advanced glass planarization processes in semiconductor manufacturing. Formulated with precisely ...

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