Cerium Oxide Polishing Powder for Fused Silica Precision Component Finishing
Product Details
| Chemical Formula: | CeO₂ | CAS No.: | 1306-38-3 |
|---|---|---|---|
| CeO₂ Purity: | ≥99% | Particle Size: | 0.5–1.4 μm |
| Appearance: | Light Yellow Powder | Packaging: | Customizable |
| Highlight |
Cerium Oxide Polishing Powder for Fused Silica,Rare Earth Polishing Powder for Precision Components,Cerium Oxide Powder with High Polishing Performance |
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Product Description
Cerium Oxide Polishing Powder for Fused Silica Precision Component Finishing
Product Overview
Fused silica grade cerium oxide polishing powder is a premium rare earth abrasive tailored for precision finishing of fused silica and quartz glass components. Tight particle size control reduces subsurface damage and micro-scratches, critical for laser optics and semiconductor quartz parts that require high laser damage threshold.
Key Features
- Strict PSD control to reduce subsurface damage
- Low micro scratch for high laser damage threshold requirement
- High chemical activity for fused silica material removal
- Low impurity content for semiconductor quartz applications
- Consistent polishing results for high-end quartz manufacturing
Particle Size Distribution
Applications
- Laser optics fused silica component finishing
- Semiconductor quartz wafer & quartz chamber parts polishing
- UV quartz glass precision lapping
- High-end quartz window surface processing
Frequently Asked Questions
Q: Is this powder suitable for laser optics?
A: Yes, it is designed to minimize subsurface damage, which is critical for laser damage resistance.
Q: Can you provide COA including particle size report?
A: Each shipment comes with COA and particle size distribution test report.
Q: Can we customize particle size?
A: Yes
Product Highlights
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