34 Results For

"cerium rare earth metal powder"

Calidad En polvo sólido de acetato de cerio de tierras raras para catalizadores Fábrica

En polvo sólido de acetato de cerio de tierras raras para catalizadores

Cerium Acetate Molecular Formula: Ce(AC)₃·xH₂O Appearance: Cerium acetate is a white snowflake-like solid Application: Used as a raw material for other cerium salts and cerium oxide, as well as petroleum additives, etc. Item Specification Testing Standard Item Ce(AC)3-3N5 Ce(AC)3-4N Ce(AC)3-4N5 Ce(AC)3-5N TREO(wt%) ≥45 ≥45 ≥45 ≥45 Rare Earth Relative Purity (wt%) La2O3/TREO ≤0.01 ≤0.005 ≤0.003 ≤0.0004 GB/T 18115.2 CeO2/TREO ≥99.95 ≥99.99 ≥99.995 ≥99.999 Pr6O11/TREO ≤0.01 ≤0

Calidad Polvo de pulido de óxido de cerio CMP para obleas de vidrio semiconductor Fábrica

Polvo de pulido de óxido de cerio CMP para obleas de vidrio semiconductor

Cerium Oxide Polishing Powder for Semiconductor Wafers Description Lichen Cerium Oxide Polishing Powder for Semiconductor Wafers is a high-purity, precision-engineered abrasive designed for wafer surface finishing and planarization processes. With tightly controlled particle size distribution and low metallic impurities, this polishing powder delivers uniform material removal, excellent surface smoothness, and low defect density, supporting the stringent requirements of

Calidad Pasta de polvo de pulido de cerio personalizado para pulido de obleas de semiconductores Fábrica

Pasta de polvo de pulido de cerio personalizado para pulido de obleas de semiconductores

Polishing Powder For Ultra-Fine Wafer Polishing Description Lichen Cerium-Based Polishing Slurry for Fine Planarization of Semiconductor Glass is a high-purity, ready-to-use slurry engineered for advanced glass planarization processes in semiconductor manufacturing. Formulated with precisely controlled cerium oxide particles, this slurry delivers excellent surface flatness, low roughness, and minimal defect generation, meeting the stringent requirements of modern semiconducto

Calidad Polvo de polvo de cerio CMP Óxido de cerio para el pulido de vidrio Wafer de silicio Fábrica

Polvo de polvo de cerio CMP Óxido de cerio para el pulido de vidrio Wafer de silicio

Polishing Powder for Silicon Wafer CMP Description Achieve the extreme planarity required for semiconductor nodes with our Advanced Cerium Oxide (CeO₂) Polishing Powders. Specifically engineered for Chemical Mechanical Planarization (CMP), our powders are designed for the high-volume manufacturing of silicon wafers, delivering the atomic-level smoothness essential for sub-7nm logic and 3D NAND memory architectures. Our formulations utilize precisely controlled particle

Calidad Llorera de óxido de cerio de planarización fina para vidrio semiconductor Fábrica

Llorera de óxido de cerio de planarización fina para vidrio semiconductor

Slurry For Fine Planarization Of Semiconductor Glass Description Lichen Cerium-Based Polishing Slurry for Fine Planarization of Semiconductor Glass is a high-purity, ready-to-use slurry engineered for advanced glass planarization processes in semiconductor manufacturing. Formulated with precisely controlled cerium oxide particles, this slurry delivers excellent surface flatness, low roughness, and minimal defect generation, meeting the stringent requirements of modern

Calidad Planarización Óxido de cerio Slurry pasta de pulido abrasivo para vidrio semiconductor Fábrica

Planarización Óxido de cerio Slurry pasta de pulido abrasivo para vidrio semiconductor

Cerium Oxide Slurry For Semiconductor Glass Substrates Description Lichen Cerium Oxide Slurry for Semiconductor Glass Substrates is a high-purity, water-based polishing slurry formulated specifically for semiconductor glass applications. This slurry provides excellent material removal rates, consistent surface finishes, and precise planarization, making it ideal for polishing semiconductor glass substrates used in wafer-level packaging, photomasks, and advanced integrated

Calidad CMP de metal de protección UV Slurry de óxido de cerio para el pulido de vidrio de pre-revestimiento Fábrica

CMP de metal de protección UV Slurry de óxido de cerio para el pulido de vidrio de pre-revestimiento

Cerium Oxide Slurry For Pre-coating Glass Polishing Description Lichen Cerium Oxide Slurry for Pre-Coating Glass Polishing is a high-performance, cerium oxide-based slurry designed specifically for pre-coating glass polishing. Ideal for use in the glass manufacturing and coating industries, this slurry ensures a smooth, defect-free surface that is essential for optimal adhesion and uniformity of glass coatings. Whether you are working with automotive glass, architectural

Calidad Polvo de limpieza OEM para parabrisas de automóviles Cas 1306-38-3 Fábrica

Polvo de limpieza OEM para parabrisas de automóviles Cas 1306-38-3

Polishing Powder For Automotive Glass And Windshields Description Lichen Cerium Oxide Polishing Powder for Automotive Glass and Windshields is a high-purity, fine-grade polishing material designed to deliver superior results in the automotive glass industry. Engineered for precision finishing, this cerium oxide polishing powder ensures high-quality surface smoothness, gloss, and clarity, making it ideal for polishing automotive glass, windshields, and other critical glass

Calidad Polvo de alta pureza para las pantallas OLED Fábrica

Polvo de alta pureza para las pantallas OLED

High Purity Polishing Slurry For OLED DisplaysDescriptionLichen High-Purity Polishing Slurry for OLED Displays is an advanced cerium oxide-based slurry designed to meet the demanding requirements of OLED display production. Engineered for ultra-smooth finishes, our slurry provides exceptional surface quality, critical for OLED panels, ensuring high optical performance, color accuracy, and long-term reliability.Our slurry is ideal for polishing the glass substrates and fine

Calidad 2.2μM Ph Polishing Neutral CMP Slurry para sustratos de obleas de vidrio Fábrica

2.2μM Ph Polishing Neutral CMP Slurry para sustratos de obleas de vidrio

CMP Slurry For Glass Wafer Substrates Description Lichen CMP Slurry for Glass Wafer Substrates is a high-purity, ready-to-use polishing slurry formulated for precision chemical-mechanical planarization (CMP) of glass wafer substrates. Designed for the advanced semiconductor, photonics, and microelectronics industries, this slurry ensures optimal material removal, uniform surface polishing, and low defect density, meeting the strict requirements for high-performance glass

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