جودة Ultra-Fine Ceria Polishing Powder for Laser Crystal and Photonics Applications مصنع
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جودة Ultra-Fine Ceria Polishing Powder for Laser Crystal and Photonics Applications مصنع
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Ultra-Fine Ceria Polishing Powder for Laser Crystal and Photonics Applications

الاسم التجاري: LICHEN
رقم الطراز: إل سي
مكان المنشأ: الصين
شهادة: ISO
كمية الحد الأدنى للطلب: 20 كلغ
سعر: Contact us
القدرة على التوريد: 3000 مليون طن / سنة

تفاصيل المنتج


نقاء: ≥ 99.95% D50: 0.3 - 0.6 ميكرومتر
صلابة: هيكل جلخ دقيق يمكن التحكم فيه المحتوى الصلب الموصى به: 5 – 15% وزناً من الطين
مظهر: مسحوق أصفر فاتح استقرار التشتت: عالي
إبراز

Ceria polishing powder for laser crystals,Ultra-fine rare earth polishing compound,Photonics-grade cerium oxide polishing powder

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Ultra-fine rare earth polishing compound

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Photonics-grade cerium oxide polishing powder

وصف المنتج


Ultra-Fine Ceria Polishing Powder for Laser Crystal and Photonics Applications

Product Overview

Ultra-Fine Ceria Polishing Powder is developed for polishing laser crystals and advanced photonic materials requiring ultra-low subsurface damage and exceptional surface smoothness. The formulation balances mechanical abrasion and chemical reactivity to achieve controlled polishing with minimized micro-scratches.

It is ideal for high-value optical substrates used in laser and photonics industries.

Key Features

  • Ultra-fine particle engineering for nanometer-level finishing
  • Low subsurface damage polishing mechanism
  • High surface transparency improvement
  • Excellent dispersion stability
  • Reduced polishing time with high surface precision
  • Consistent batch-to-batch performance


Particle Size Distribution

Ultra-Fine Ceria Polishing Powder for Laser Crystal and Photonics Applications 0

Applications

  • Laser crystal polishing (YAG, sapphire, fused silica)
  • Photonic substrates finishing
  • Optical waveguides polishing
  • High-power laser optics
  • Optical communication components
  • Scientific optical instruments

 Frequently Asked Questions

Q1: What surface quality can be achieved?
Surface roughness below Ra 1 nm can be achieved depending on process conditions.

Q2: Can the powder be converted into slurry?
Yes. The powder disperses easily into deionized water to prepare customized polishing slurry.

Q3: Is it suitable for automated polishing machines?
Yes, it is optimized for both manual and CNC optical polishing systems.

أبرز المنتجات

Ultra-Fine Ceria Polishing Powder for Laser Crystal and Photonics Applications Product Overview Ultra-Fine Ceria Polishing Powder is developed for polishing laser crystals and advanced photonic materials requiring ultra-low subsurface damage and exceptional surface smoothness. The formulation ...

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جودة Ultra-Fine Ceria Polishing Powder for Laser Crystal and Photonics Applications مصنع

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Ultra-Fine Ceria Polishing Powder for Laser Crystal and Photonics Applications Product Overview Ultra-Fine Ceria Polishing Powder is developed for polishing laser crystals and advanced photonic materials requiring ultra-low subsurface damage and exceptional surface smoothness. The formulation balances mechanical abrasion and chemical reactivity to achieve controlled polishing with minimized micro-scratches. It is ideal for high-value optical substrates used in laser and

جودة مسحوق تلميع أكسيد السيريوم بدرجة أشباه الموصلات للرقائق والركائز المتقدمة مصنع

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Semiconductor Grade Cerium Oxide Polishing Powder for Wafer & Advanced Substrates Product Overview Semiconductor Grade Cerium Oxide Polishing Powder is formulated for defect-sensitive polishing applications in semiconductor and advanced electronic substrate manufacturing. The controlled purity and particle engineering reduce contamination risks while ensuring consistent planarization performance. Optimized for preparation of CMP slurries used in semiconductor wafer processing

اطلب اقتباس

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يمكنك تحميل ما يصل إلى 5 ملفات وكل ملف بحجم 10M أقصى.