Ultra-Fine Ceria Polishing Powder for Laser Crystal and Photonics Applications
Λεπτομέρειες προιόντος
| Καθαρότητα: | ≥ 99,95% | D50: | 0,3 – 0,6 μm |
|---|---|---|---|
| Σκληρότητα: | Ελεγχόμενη μικρο-λειαντική δομή | Συνιστώμενο στερεό περιεχόμενο: | 5 – 15 wt% πολτός |
| Εμφάνιση: | ανοιχτοκίτρινη σκόνη | Σταθερότητα διασποράς: | Ψηλά |
| Επισημαίνω |
Ceria polishing powder for laser crystals,Ultra-fine rare earth polishing compound,Photonics-grade cerium oxide polishing powder |
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Περιγραφή προϊόντων
Ultra-Fine Ceria Polishing Powder for Laser Crystal and Photonics Applications
Product Overview
Ultra-Fine Ceria Polishing Powder is developed for polishing laser crystals and advanced photonic materials requiring ultra-low subsurface damage and exceptional surface smoothness. The formulation balances mechanical abrasion and chemical reactivity to achieve controlled polishing with minimized micro-scratches.
It is ideal for high-value optical substrates used in laser and photonics industries.
Key Features
- Ultra-fine particle engineering for nanometer-level finishing
- Low subsurface damage polishing mechanism
- High surface transparency improvement
- Excellent dispersion stability
- Reduced polishing time with high surface precision
- Consistent batch-to-batch performance
Particle Size Distribution
Applications
- Laser crystal polishing (YAG, sapphire, fused silica)
- Photonic substrates finishing
- Optical waveguides polishing
- High-power laser optics
- Optical communication components
- Scientific optical instruments
Frequently Asked Questions
Q1: What surface quality can be achieved?
Surface roughness below Ra 1 nm can be achieved depending on process conditions.
Q2: Can the powder be converted into slurry?
Yes. The powder disperses easily into deionized water to prepare customized polishing slurry.
Q3: Is it suitable for automated polishing machines?
Yes, it is optimized for both manual and CNC optical polishing systems.
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