Ultra-Fine Ceria Polishing Powder for Laser Crystal and Photonics Applications
제품 상세정보
| 청정: | ≥ 99.95% | D50: | 0.3~0.6μm |
|---|---|---|---|
| 경도: | 제어된 미세 연마 구조 | 추천 솔리드 콘텐츠: | 5 – 15 중량% 슬러리 |
| 모습: | 밝은 노란색 분말 | 분산 안정성: | 높은 |
| 강조하다 |
Ceria polishing powder for laser crystals,Ultra-fine rare earth polishing compound,Photonics-grade cerium oxide polishing powder |
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제품 설명
Ultra-Fine Ceria Polishing Powder for Laser Crystal and Photonics Applications
Product Overview
Ultra-Fine Ceria Polishing Powder is developed for polishing laser crystals and advanced photonic materials requiring ultra-low subsurface damage and exceptional surface smoothness. The formulation balances mechanical abrasion and chemical reactivity to achieve controlled polishing with minimized micro-scratches.
It is ideal for high-value optical substrates used in laser and photonics industries.
Key Features
- Ultra-fine particle engineering for nanometer-level finishing
- Low subsurface damage polishing mechanism
- High surface transparency improvement
- Excellent dispersion stability
- Reduced polishing time with high surface precision
- Consistent batch-to-batch performance
Particle Size Distribution
Applications
- Laser crystal polishing (YAG, sapphire, fused silica)
- Photonic substrates finishing
- Optical waveguides polishing
- High-power laser optics
- Optical communication components
- Scientific optical instruments
Frequently Asked Questions
Q1: What surface quality can be achieved?
Surface roughness below Ra 1 nm can be achieved depending on process conditions.
Q2: Can the powder be converted into slurry?
Yes. The powder disperses easily into deionized water to prepare customized polishing slurry.
Q3: Is it suitable for automated polishing machines?
Yes, it is optimized for both manual and CNC optical polishing systems.
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아래의 온라인 문의 연락 양식을 사용하시기 바랍니다. 질문이 있으시면 저희 팀이 가능한 한 빨리 연락합니다.
