"rare earth oxide white powder"
Tailored Glass Polishing Paste Powder 3 Micron For Silicon Wafer
Tailored Polishing Powder For Silicon Wafer Manufacturing Description Lichen Tailored Polishing Powder for Silicon Wafer Manufacturing is a premium cerium oxide-based powder formulated to deliver exceptional performance in the polishing of silicon wafers used in semiconductor manufacturing. Designed to meet the stringent requirements of the semiconductor industry, this powder offers unparalleled control over the material removal rate, surface flatness, and defect reduction,
Metallic LaCl3 Lanthanum Chloride Sandy for petroleum catalyst
THE BEST FACTORY DIRECT SALES PROFESSIONAL LANTHANUM CHLORIDE (SANDY) Lanthanum Chloride (Sandy) Molecular Formula: LaCl6HOAppearance: Sandy crystalApplication: Used as petroleum catalyst, and also for the production of metallic lanthanum Item GradeSpecification LaCl-3N5A LaCl-4N5A LaCl-5NA Test Basis TREO (wt%) 42.0 42.0 42.0 Rare Earth Relative Purity (wt%) LaO/TREO 99.95 99.995 99.999 Refer to GB/T 18115.1 CeO/TREO 0.01 0.003 0.0005 PrO/TREO 0.01 0
High-purity Nano Ceria CMP Slurry (200nm Particle Size) Designed For Semiconductor
High-purity Nano Ceria CMP Slurry (200nm Particle Size) Designed For Semiconductor Descripti on High-purity nano ceria CMP slurry (100nm particle size) designed for semiconductor and advanced surface finishing. Stable dispersion, high removal rate, and ultra-low surface defects. It is ideal for next-generation precision polishing processes demanding nanometer-level surface control. Key Features & Advantages Nano-Scale Precision Polishing The 100 nm ceria particles enable
Water Based CeO2 Chemical Mechanical Polishing Slurry For Glass Defect Removal
Polishing Slurry For Float Glass Surface Defect RemovalDescriptionLichen Polishing Slurry for Float Glass Surface Defect Removal is a cerium oxide-based slurry specifically formulated to effectively remove surface defects from float glass. Whether addressing scratches, water spots, haze, or micro-defects, our slurry delivers superior material removal rates and enhances surface clarity, making it ideal for both manufacturing and post-production glass surface restoration
Customized Chemical Mechanical Polishing CMP Slurry Sub Nanometer LCD Panel
Customized Polishing Slurry for LCD Panel Manufacturing Description Engineered for the stringent demands of display technologies, our customized cerium oxide slurries provide the high-precision finishing required for high-generation LCD and liquid crystal glass substrates. As automotive and consumer electronics move toward ultra-thin and curved profiles, our slurries deliver the sub-nanometer flatness and surface integrity essential for uniform light transmission. Core
2.2μM Ph Neutral Polishing CMP Slurry For Glass Wafer Substrates
CMP Slurry For Glass Wafer Substrates Description Lichen CMP Slurry for Glass Wafer Substrates is a high-purity, ready-to-use polishing slurry formulated for precision chemical-mechanical planarization (CMP) of glass wafer substrates. Designed for the advanced semiconductor, photonics, and microelectronics industries, this slurry ensures optimal material removal, uniform surface polishing, and low defect density, meeting the strict requirements for high-performance glass
