2.2μM Ph Neutral Polishing CMP Slurry For Glass Wafer Substrates
Product Details
| Particle Size: | 0.8-2.2μm | CAS No.: | 1306-38-3 |
|---|---|---|---|
| CeO₂: | 99% | Suspension Rate: | High |
| PH Range: | 7-10 | Application: | Glass Wafer Substrates |
| Highlight |
2.2μm cmp slurry,ph neutral cmp slurry,CMP diamond slurry polishing |
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Product Description
CMP Slurry For Glass Wafer Substrates
Description
Lichen CMP Slurry for Glass Wafer Substrates is a high-purity, ready-to-use polishing slurry formulated for precision chemical-mechanical planarization (CMP) of glass wafer substrates. Designed for the advanced semiconductor, photonics, and microelectronics industries, this slurry ensures optimal material removal, uniform surface polishing, and low defect density, meeting the strict requirements for high-performance glass wafer substrates used in wafer-level packaging, MEMS devices, photomasks, and optical components.
Engineered for high-throughput, high-yield applications, Lichen's CMP slurry delivers superior performance in polishing glass wafers, helping customers achieve consistent results while minimizing production costs.
Key Features & Advantages
High-Purity Cerium Oxide Abrasives
Extremely low metal impurity levels to prevent contamination and ensure superior polishing consistency for sensitive glass wafer applications.
Optimized Particle Size Distribution
Fine, uniform particles for controlled material removal and minimal surface damage, resulting in smooth, defect-free glass wafers.
Superior Planarization Performance
Achieves ultra-smooth, flat surfaces with low roughness, critical for subsequent lithography, bonding, or coating processes.
Low Defect Generation
Minimizes micro-scratches, pits, and haze, ensuring a high-quality surface finish and reducing yield losses in semiconductor fabrication.
Stable and Consistent Performance
Reliable slurry dispersion with consistent performance across different wafer types and production batches.
Tech Data
| Molecular Formula | CAS No. | CeO₂ % | D50 (μm) | Appearance | Application |
| CeO2 | 1306-38-3 | 99 | 0.8-2.2μm | White Slurry | Glass Wafer Substrates |
Particle Size Distribution

Q&A
1. What is rare earth polishing powder?
Rare earth polishing powder is a high-purity compound used for polishing optical components, semiconductor wafers, and delicate surfaces like glass and lenses. It delivers a smooth, high-clarity finish without damaging the material.
2. How do I choose the right rare earth polishing powder for my application?
To select the ideal polishing powder, consider factors like the material you’re polishing, the required finish, and specifications like particle size and purity. Our sales team is available to help you choose the perfect product for your needs.
3. How should I store rare earth polishing powder?
Store in a cool, dry place, away from moisture and direct sunlight. Keep the powder in airtight containers to prevent contamination and maintain its effectiveness. With proper storage, it typically lasts 1-2 years.
4. Do you provide customized rare earth formulations?
Yes, we offer custom rare earth polishing powders and slurries, tailored to meet your specific needs, including adjustments to particle size, chemical composition, or slurry consistency.
5. Can I get a sample before making a bulk order?
Absolutely! We provide samples for evaluation. Contact our team to request a sample, and we’ll arrange the shipment.
6. How can I place an order? What is the typical delivery time?
To place an order, simply contact our sales team, who will guide you through the process and provide a quote. Delivery times vary based on order size, location, and stock availability, and we’ll give you an estimated schedule once the order is confirmed.
Product Highlights
CMP Slurry For Glass Wafer Substrates Description Lichen CMP Slurry for Glass Wafer Substrates is a high-purity, ready-to-use polishing slurry formulated for precision chemical-mechanical planarization (CMP) of glass wafer substrates. Designed for the advanced semiconductor, photonics, and ...
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