114 Results For

"rare earth oxide white powder"

품질 실리콘 웨이퍼를 위한 맞춤형 유리 닦기 페이스트 파우더 3 미크론 공장

실리콘 웨이퍼를 위한 맞춤형 유리 닦기 페이스트 파우더 3 미크론

Tailored Polishing Powder For Silicon Wafer Manufacturing Description Lichen Tailored Polishing Powder for Silicon Wafer Manufacturing is a premium cerium oxide-based powder formulated to deliver exceptional performance in the polishing of silicon wafers used in semiconductor manufacturing. Designed to meet the stringent requirements of the semiconductor industry, this powder offers unparalleled control over the material removal rate, surface flatness, and defect reduction,

품질 금속 LaCl3 란탄 엽록소 모래 석유 촉매용 공장

금속 LaCl3 란탄 엽록소 모래 석유 촉매용

THE BEST FACTORY DIRECT SALES PROFESSIONAL LANTHANUM CHLORIDE (SANDY) Lanthanum Chloride (Sandy) Molecular Formula: LaCl₃·6H₂OAppearance: Sandy crystalApplication: Used as petroleum catalyst, and also for the production of metallic lanthanum Item GradeSpecification LaCl₃-3N5A LaCl₃-4N5A LaCl₃-5NA Test Basis TREO (wt%) ≥42.0 ≥42.0 ≥42.0 Rare Earth Relative Purity (wt%) La₂O₃/TREO ≥99.95 ≥99.995 ≥99.999 Refer to GB/T 18115.1 CeO₂/TREO ≤0.01 ≤0.003 ≤0.0005 Pr₆O₁₁/TREO ≤0.01 ≤0

품질 반도체용으로 설계된 고순도 나노 세리아 CMP 슬러리 (200nm 입자 크기) 공장

반도체용으로 설계된 고순도 나노 세리아 CMP 슬러리 (200nm 입자 크기)

High-purity Nano Ceria CMP Slurry (200nm Particle Size) Designed For Semiconductor Descripti on High-purity nano ceria CMP slurry (100nm particle size) designed for semiconductor and advanced surface finishing. Stable dispersion, high removal rate, and ultra-low surface defects. It is ideal for next-generation precision polishing processes demanding nanometer-level surface control. Key Features & Advantages Nano-Scale Precision Polishing The 100 nm ceria particles enable

품질 물 기반의 CeO2 화학적 기계적 닦기 슬러리 유리 결함 제거 공장

물 기반의 CeO2 화학적 기계적 닦기 슬러리 유리 결함 제거

Polishing Slurry For Float Glass Surface Defect RemovalDescriptionLichen Polishing Slurry for Float Glass Surface Defect Removal is a cerium oxide-based slurry specifically formulated to effectively remove surface defects from float glass. Whether addressing scratches, water spots, haze, or micro-defects, our slurry delivers superior material removal rates and enhances surface clarity, making it ideal for both manufacturing and post-production glass surface restoration

품질 사용자 정의 화학 기계 닦기 CMP 슬러리 서브 나노미터 LCD 패널 공장

사용자 정의 화학 기계 닦기 CMP 슬러리 서브 나노미터 LCD 패널

Customized Polishing Slurry for LCD Panel Manufacturing Description Engineered for the stringent demands of display technologies, our customized cerium oxide slurries provide the high-precision finishing required for high-generation LCD and liquid crystal glass substrates. As automotive and consumer electronics move toward ultra-thin and curved profiles, our slurries deliver the sub-nanometer flatness and surface integrity essential for uniform light transmission. Core

품질 2.2μM Ph 중립 닦기 CMP 유리 웨이퍼 기판용 슬러리 공장

2.2μM Ph 중립 닦기 CMP 유리 웨이퍼 기판용 슬러리

CMP Slurry For Glass Wafer Substrates Description Lichen CMP Slurry for Glass Wafer Substrates is a high-purity, ready-to-use polishing slurry formulated for precision chemical-mechanical planarization (CMP) of glass wafer substrates. Designed for the advanced semiconductor, photonics, and microelectronics industries, this slurry ensures optimal material removal, uniform surface polishing, and low defect density, meeting the strict requirements for high-performance glass

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