Ultra-Precision Cerium Oxide Slurry for Laser Crystals & Advanced Optical Materials
Dettagli del prodotto
| Materiale abrasivo: | CeO2 | Dimensione delle particelle (D50): | 80 – 200 nm |
|---|---|---|---|
| contenuto solido: | 5 – 30% in peso | pH: | 6.5 – 8.5 |
| Capacità di finitura superficiale: | Livello sub-nanometrico | Stabilità della dispersione: | Alto |
| Evidenziare |
cerium oxide slurry for laser crystals,rare earth polishing slurry for optics,ultra-precision cerium oxide polishing compound |
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Descrizione di prodotto
Ultra-Precision Cerium Oxide Slurry for Laser Crystals & Advanced Optical Materials
Product Overview
Ultra-Precision Cerium Oxide Slurry is developed for final polishing of high-value optical and laser materials requiring high-level surface quality. The controlled particle distribution enables superior surface finish while preserving material integrity.
Optimized for polishing hard and brittle materials used in laser, photonics, and high-performance optical systems.
Key Features
- Ultra-fine polishing capability
- Exceptional surface finish quality
- Minimal subsurface damage
- Stable chemical-mechanical interaction
- High consistency between polishing batches
- Suitable for final finishing processes
Particle Size Distribution
Applications
- Laser crystal polishing (YAG, sapphire, fused silica)
- Precision optical components finishing
- Photonics and laser optics manufacturing
- High-power laser mirrors
- Scientific optical instruments
- Aerospace optical components
Frequently Asked Questions
Q1. What is Cerium Oxide CMP slurry used for?
Cerium Oxide CMP slurry is a chemical-mechanical polishing material designed for ultra-precision surface finishing. It combines mechanical abrasion and chemical interaction to achieve high material removal efficiency while maintaining excellent surface smoothness.
Q2. How do I select the correct ceria slurry for my application?
Selection mainly depends on material type and process target.
Our technical team can assist in optimizing slurry selection based on polishing machine, pad type, and surface quality requirements.
Q3. What materials can be polished using cerium oxide slurry?
Cerium oxide CMP slurry is suitable for a wide range of advanced materials:
- Optical glass
- Sapphire
- Silicon wafers
- Laser crystals (YAG, etc.)
- Photonic substrates
- Compound semiconductor materials
Caratteristiche del prodotto
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Ultra-Precision Cerium Oxide Slurry for Laser Crystals & Advanced Optical Materials
Ultra-Precision Cerium Oxide Slurry for Laser Crystals & Advanced Optical Materials Product Overview Ultra-Precision Cerium Oxide Slurry is developed for final polishing of high-value optical and laser materials requiring high-level surface quality. The controlled particle distribution enables superior surface finish while preserving material integrity. Optimized for polishing hard and brittle materials used in laser, photonics, and high-performance optical systems. Key
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