High Removal Rate Ceria Slurry for Optical Glass and Semiconductor Polishing
Product Details
| Abrasive Material: | High Purity Cerium Oxide | Particle Size (D50): | 0.3 – 1.0 μm |
|---|---|---|---|
| Solid Content: | 10 – 30 Wt% | PH: | 6.5 – 9.0 |
| Appearance: | White Slurry | Surface Finish: | Ultra Precision |
| Highlight |
Ceria slurry for optical glass polishing,High removal rate semiconductor polishing slurry,Rare earth ceria polishing slurry |
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Product Description
High Removal Rate Ceria Slurry for Optical Glass and Semiconductor Polishing
Product Overview
High removal rate ceria slurry developed for fast and efficient polishing of optical glass and semiconductor substrates. Combines excellent material removal performance with stable surface quality to improve production efficiency and reduce processing time.
Key Features
- High polishing efficiency and throughput
- Fast material removal capability
- Excellent process stability
- Reduced polishing cycle time
- Uniform particle distribution
- Suitable for large-scale industrial polishing
Particle Size Distribution
Applications
- Optical glass polishing
- Semiconductor substrate polishing
- LCD glass polishing
- Precision ceramic polishing
- Large-scale optics manufacturing
- High throughput polishing production lines
Why Choose Lichen as Your Global Supplier
- Dedicated ceria & alumina polishing manufacturer
- Stable rare earth raw material supply chain
- Customized particle engineering capability
- Consistent batch-to-batch quality control
- Technical support for polishing process optimization
Product Highlights
High Removal Rate Ceria Slurry for Optical Glass and Semiconductor Polishing Product Overview High removal rate ceria slurry developed for fast and efficient polishing of optical glass and semiconductor substrates. Combines excellent material removal performance with stable surface quality to ...
High Removal Rate Ceria Slurry for Optical Glass and Semiconductor Polishing
High Removal Rate Ceria Slurry for Optical Glass and Semiconductor Polishing Product Overview High removal rate ceria slurry developed for fast and efficient polishing of optical glass and semiconductor substrates. Combines excellent material removal performance with stable surface quality to improve production efficiency and reduce processing time. Key Features High polishing efficiency and throughput Fast material removal capability Excellent process stability Reduced
High Performance Ceria Slurry for Sapphire Wafer and Crystal Polishing
High Performance Ceria Slurry for Sapphire Wafer and Crystal Polishing Product Overview Professional ceria slurry optimized for sapphire polishing applications in semiconductor and optical industries. Achieves high surface smoothness, stable polishing efficiency, and low subsurface damage for sapphire wafers, LED substrates, and optical crystals. Key Features Optimized for hard sapphire materials Excellent polishing efficiency and surface quality Low subsurface damage Stable
Scratch Free Ceria Polishing Slurry for Precision Optical Components
Scratch Free Ceria Polishing Slurry for Precision Optical Components Product Overview Scratch free ceria polishing slurry engineered for ultra-precision optical polishing applications. Provides excellent surface finish, minimized micro-scratches, and superior polishing consistency for optical lenses, prisms, and photonic components. Key Features Ultra-low scratch polishing performance High surface finish quality and clarity Narrow particle size distribution Excellent
High Purity CMP Slurry For Silicon Wafer Planarization
High Purity CMP Slurry For Silicon Wafer Planarization Product Overview Advanced CMP slurry designed for silicon wafer polishing in semiconductor manufacturing. Delivers excellent surface planarization, low defectivity, stable removal rate, and superior wafer surface quality for IC, MEMS, and advanced electronic applications. Key Features High planarization efficiency for silicon wafers Excellent surface smoothness and low scratch performance Stable particle size distribution
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