High Removal Rate Ceria Slurry for Optical Glass and Semiconductor Polishing
Product Details
| Abrasive Material: | High Purity Cerium Oxide | Particle Size (D50): | 0.3 – 1.0 μm |
|---|---|---|---|
| Solid Content: | 10 – 30 Wt% | PH: | 6.5 – 9.0 |
| Appearance: | White Slurry | Surface Finish: | Ultra Precision |
| Highlight |
Ceria slurry for optical glass polishing,High removal rate semiconductor polishing slurry,Rare earth ceria polishing slurry |
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Product Description
High Removal Rate Ceria Slurry for Optical Glass and Semiconductor Polishing
Product Overview
High removal rate ceria slurry developed for fast and efficient polishing of optical glass and semiconductor substrates. Combines excellent material removal performance with stable surface quality to improve production efficiency and reduce processing time.
Key Features
- High polishing efficiency and throughput
- Fast material removal capability
- Excellent process stability
- Reduced polishing cycle time
- Uniform particle distribution
- Suitable for large-scale industrial polishing
Particle Size Distribution
Applications
- Optical glass polishing
- Semiconductor substrate polishing
- LCD glass polishing
- Precision ceramic polishing
- Large-scale optics manufacturing
- High throughput polishing production lines
Why Choose Lichen as Your Global Supplier
- Dedicated ceria & alumina polishing manufacturer
- Stable rare earth raw material supply chain
- Customized particle engineering capability
- Consistent batch-to-batch quality control
- Technical support for polishing process optimization
Product Highlights
High Removal Rate Ceria Slurry for Optical Glass and Semiconductor Polishing Product Overview High removal rate ceria slurry developed for fast and efficient polishing of optical glass and semiconductor substrates. Combines excellent material removal performance with stable surface quality to ...
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