High-Purity Cerium Oxide for Precision Industrial Applications
Product Details
| Chemical Formula: | CeO₂ | Purity: | ≥99.5% |
|---|---|---|---|
| Particle Size (D50): | 0.3-3.0 μm (customizable) | Color: | Light Yellow |
| Moisture: | ≤0.5% | Bulk Density: | 0.8-1.2 G/cm³ |
| Highlight |
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Product Description
High-Purity Cerium Oxide for Precision Industrial Applications
Product Overview
High-purity Cerium Oxide (CeO₂) is a rare-earth oxide widely used in advanced industrial processes requiring high surface activity, controlled particle size, and excellent chemical stability. It is particularly valued in precision polishing, catalytic systems, and functional additive applications. Our material is engineered for consistent performance in global manufacturing environments.
Key Features
- Ultra-high purity grades available (≥99.5%)
- Controlled submicron and nanoscale particle distribution
- Excellent polishing efficiency for glass and ceramics
- Strong redox capability (Ce³⁺/Ce⁴⁺ cycle)
- High thermal stability and chemical resistance
- Low impurity content (Fe, Si, Ca strictly controlled)
Particle Size Distribution
Applications
- Precision optical glass polishing (lenses, prisms, wafers)
- TFT-LCD and semiconductor surface finishing
- Catalytic converters (automotive exhaust treatment)
- Glass decolorization and refining
- Chemical mechanical polishing (CMP) processes
- Functional additive in ceramics and coatings
Frequently Asked Questions
Q1: Why is cerium oxide used in polishing?
A1: Due to its unique redox behavior and hardness, it enables efficient material removal with minimal surface damage.
Q2: Can particle size be customized?
A2: Yes, we offer tailored D50 distributions depending on polishing or catalytic requirements.
Q3: Is it suitable for semiconductor applications?
A3: Yes, high-purity grades are widely used in CMP and precision wafer processing.
Product Highlights
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