Alumina CMP Slurry | Aluminum Oxide Slurry For Chemical Mechanical Planarization
รายละเอียดสินค้า
| D50: | 80 – 250 นาโนเมตร | พีเอช: | ปรับได้ |
|---|---|---|---|
| เนื้อหาที่เป็นของแข็ง: | 5 – 20 เปอร์เซ็นต์โดยน้ำหนัก | การกระจายตัวของอนุภาค: | PSD แบบแคบ |
| ความเสถียรในการกระจายตัว: | ยอดเยี่ยม | ประสิทธิภาพการขีดข่วน: | ต่ำ |
| เน้น |
alumina CMP slurry for planarization,aluminum oxide slurry chemical mechanical,CMP slurry with aluminum oxide |
||
คําอธิบายสินค้า
Alumina CMP Slurry | Aluminum Oxide Slurry For Chemical Mechanical Planarization
Overview:
Alumina CMP Slurry is a semiconductor-grade polishing material developed for high-precision chemical mechanical planarization (CMP) processes used in integrated circuit manufacturing and advanced electronic materials processing.
The slurry combines finely engineered aluminum oxide abrasive particles with optimized chemical formulations to achieve uniform material removal and superior wafer surface planarization. Its controlled mechanical action enables efficient polishing while maintaining low defect density and excellent surface integrity.
Engineered for compatibility with modern CMP equipment, the slurry supports stable operation in high-volume semiconductor production environments and delivers consistent performance across extended polishing cycles.
Key Features & Advantages
Precision Wafer Planarization
Provides excellent global and local planarization performance required for multilayer semiconductor structures.
Stable Material Removal Rate
Ensures predictable polishing behavior across different wafer batches and production cycles.
Low Defect & Scratch Control
Advanced dispersion technology minimizes particle agglomeration and reduces micro-scratch formation.
High Process Reliability
Designed for continuous semiconductor manufacturing with minimal process variation.
Particle Size Distribution
Typical Applications
Semiconductor Manufacturing
- Silicon wafer CMP
- Oxide layer planarization
- Metal layer polishing
- Interlayer dielectric polishing
Manufacturing & Quality Assurance
Produced using advanced slurry manufacturing technology:
- High-purity alumina
- Nano-scale dispersion engineering
- Strict semiconductor-grade quality control
Why Choose Our Alumina CMP Slurry
Dedicated CMP material manufacturer
- Semiconductor process understanding
- Custom slurry development capability
- Stable international supply chain
- Technical application support
Q&A
1. Can I get a sample before making a bulk order?
Absolutely! We provide samples for evaluation. Contact our team to request a sample, and we’ll arrange the shipment.
2. How can I place an order? What is the typical delivery time?
To place an order, simply contact our sales team, who will guide you through the process and provide a quote. Delivery times vary based on order size, location, and stock availability, and we’ll give you an estimated schedule once the order is confirmed.
จุดเด่นของผลิตภัณฑ์
Alumina CMP Slurry | Aluminum Oxide Slurry For Chemical Mechanical Planarization Overview: Alumina CMP Slurry is a semiconductor-grade polishing material developed for high-precision chemical mechanical planarization (CMP) processes used in integrated circuit manufacturing and advanced electronic ...
Metallurgy Heavy Rare Earth Metals 35/65 Lanthanum Cerium Mischmetal
35/65 Lanthanum Cerium Rare Earth Metal Mischmetal for Alloys and Metallurgy 99.9% min Purity Molecular Formula: Ce Application: Used as a raw material for rare earth magnetic materials, an additive for special steel and non-ferrous metal alloys, and also as hydrogen storage material, electric storage material, etc. It is applied in the manufacture of glass, flint, ceramics and alloys. Item Specification Testing Standard Item Ce-2N Ce-2N5 Ce-3N Ce-4N TRE(wt%) ≥99 ≥99 ≥99 ≥99
High Quality LaCe Rare Earth Material Element Minerals Lanthanum Cerium Metal
Lanthanum Cerium Metal Chemical Formula: La+Ce Application: Used as an additive for steel and non-ferrous metals, and as a hydrogen storage matrix material. Item Specification Testing Standard Item LaCe-65CeA LaCe-65Ce B LaCe-65Ce C LaCe-65CeD TRE(wt%) ≥98.5 ≥99 ≥99 ≥99 Lanthanum-Cerium Distribution and Rare Earth Impurities (wt%) La+Ce/TREM ≥98.5 ≥99.0 ≥99.5 ≥99.9 GB/T 16484 La/TREM 35±3 35±2 35±2 35±2 Ce/TREM 65±3 65±2 65±2 65±2 稀土杂质 1.5 1 0.5 0.1 Non-Rare Earth Impurities
High Quality &Purity Rare Earth Material Lanthanum Metal For Steel And Nonferrous Metals
Hot Sale High Purity Lanthanum Metal Additives for Steel And Nonferrous Metals Molecular Formula: La Application: Used as an additive for steel and non-ferrous metals, and as a hydrogen storage matrix material. Item Specification Testing Standard Item La-2NA La-2NB La-2N5 TREM(wt%) ≥99 ≥99 ≥99.5 Rare Earth Relative Purity (wt%) La/TREM ≥99.5 ≥99.9 ≥99.99 GB/T 18115.1 Ce/TREM
Aluminum Oxide (Al₂O₃) CMP Slurry For Wafer Planarization & Precision Semiconductor Polishing
Aluminum Oxide (Al₂O₃) CMP Slurry For Wafer Planarization & Precision Semiconductor Polishing Overview: Alumina CMP Slurry (Aluminum Oxide CMP Slurry) is a high-performance chemical mechanical planarization material developed for precision surface planarization in semiconductor manufacturing and advanced electronic fabrication. Formulated using high-purity aluminum oxide abrasive particles and optimized chemical additives, the slurry provides controlled material removal while
กรุณาใช้แบบสอบถามทางออนไลน์ด้านล่าง หากคุณมีคําถาม ทีมงานของเราจะติดต่อกลับกับคุณในเร็วที่สุด
