"rare earth metal"
야외 기상 저항성 코팅용 나노 세리움 산화물
Nano Cerium Oxide for Outdoor Weather-Resistant Coatings Product Overview Nano Cerium Oxide is an advanced functional rare earth material designed to enhance the long-term performance of outdoor coating systems. Its outstanding UV absorption capability, oxygen storage capacity, and chemical stability help coatings maintain color retention, gloss, and structural integrity under prolonged exposure to sunlight, moisture, and harsh environmental conditions. The material is widely
반도체 등급의 웨이퍼 및 첨단 기판용 세리움 산화물 닦기 분말
Semiconductor Grade Cerium Oxide Polishing Powder for Wafer & Advanced Substrates Product Overview Semiconductor Grade Cerium Oxide Polishing Powder is formulated for defect-sensitive polishing applications in semiconductor and advanced electronic substrate manufacturing. The controlled purity and particle engineering reduce contamination risks while ensuring consistent planarization performance. Optimized for preparation of CMP slurries used in semiconductor wafer processing
비수성 디스프로슘 분말 네오디미움 엽수 원료
Anhydrous Neodymium Chloride Molecular Formula: NdCl₃Appearance: Anhydrous neodymium chloride is a pink powdery crystal. Application: Used for producing metallic neodymium, as a raw material in the field of pharmaceutical catalysis or single crystal growth. Item Specification Testing Standard Grade NdCl₃-3N NdCl₃-3N5 NdCl₃-4N / TREO (wt%) ≥66.0 ≥66.0 ≥66.0 / Rare Earth Relative Purity (wt%) Refer to GB/T 18115.1 La₂O₃/TREO ≤0.02 ≤0.01 ≤0.001 CeO₂/TREO ≤0.02 ≤0.01 ≤0.001 Pr₆O₁
반도체 유리 웨이퍼를 위한 CMP 세리움 산화물 닦기 분말
Cerium Oxide Polishing Powder for Semiconductor Wafers Description Lichen Cerium Oxide Polishing Powder for Semiconductor Wafers is a high-purity, precision-engineered abrasive designed for wafer surface finishing and planarization processes. With tightly controlled particle size distribution and low metallic impurities, this polishing powder delivers uniform material removal, excellent surface smoothness, and low defect density, supporting the stringent requirements of
CMP 세리움 폴러드 세리움 산화물 유리 닦기 위해 실리콘 웨이퍼
Polishing Powder for Silicon Wafer CMP Description Achieve the extreme planarity required for semiconductor nodes with our Advanced Cerium Oxide (CeO₂) Polishing Powders. Specifically engineered for Chemical Mechanical Planarization (CMP), our powders are designed for the high-volume manufacturing of silicon wafers, delivering the atomic-level smoothness essential for sub-7nm logic and 3D NAND memory architectures. Our formulations utilize precisely controlled particle
Odm 세리움 산화물 기반의 굴착 분말 및 화합물
Polishing Slurry for Ultra-Fine Electronics Surfaces Overview: Our Polishing Slurry for Ultra-Fine Electronics Surfaces is meticulously engineered to deliver precise, high-quality finishes for the most delicate electronics applications. With advanced cerium oxide-based technology, this slurry is designed for the polishing of ultra-fine surfaces in the electronics industry, ensuring smoothness, clarity, and minimal defects. Key Features: High Purity Cerium Oxide: Formulated
반도체 유리용 정밀 평면화 세리움 산화물 슬러리
Slurry For Fine Planarization Of Semiconductor Glass Description Lichen Cerium-Based Polishing Slurry for Fine Planarization of Semiconductor Glass is a high-purity, ready-to-use slurry engineered for advanced glass planarization processes in semiconductor manufacturing. Formulated with precisely controlled cerium oxide particles, this slurry delivers excellent surface flatness, low roughness, and minimal defect generation, meeting the stringent requirements of modern
반도체 웨이퍼 롤링을 위한 맞춤형 세리움 롤링 파우더 페이스트
Polishing Powder For Ultra-Fine Wafer Polishing Description Lichen Cerium-Based Polishing Slurry for Fine Planarization of Semiconductor Glass is a high-purity, ready-to-use slurry engineered for advanced glass planarization processes in semiconductor manufacturing. Formulated with precisely controlled cerium oxide particles, this slurry delivers excellent surface flatness, low roughness, and minimal defect generation, meeting the stringent requirements of modern semiconducto
평형화 세리움 산화물 매물 반도체 유리를 위한 가려진 닦기 페이스트
Cerium Oxide Slurry For Semiconductor Glass Substrates Description Lichen Cerium Oxide Slurry for Semiconductor Glass Substrates is a high-purity, water-based polishing slurry formulated specifically for semiconductor glass applications. This slurry provides excellent material removal rates, consistent surface finishes, and precise planarization, making it ideal for polishing semiconductor glass substrates used in wafer-level packaging, photomasks, and advanced integrated
2.2μM Ph 중립 닦기 CMP 유리 웨이퍼 기판용 슬러리
CMP Slurry For Glass Wafer Substrates Description Lichen CMP Slurry for Glass Wafer Substrates is a high-purity, ready-to-use polishing slurry formulated for precision chemical-mechanical planarization (CMP) of glass wafer substrates. Designed for the advanced semiconductor, photonics, and microelectronics industries, this slurry ensures optimal material removal, uniform surface polishing, and low defect density, meeting the strict requirements for high-performance glass
OEM 자동차 정면 유리창 Cas 1306-38-3에 대한 CEO2 가루 닦기
Polishing Powder For Automotive Glass And Windshields Description Lichen Cerium Oxide Polishing Powder for Automotive Glass and Windshields is a high-purity, fine-grade polishing material designed to deliver superior results in the automotive glass industry. Engineered for precision finishing, this cerium oxide polishing powder ensures high-quality surface smoothness, gloss, and clarity, making it ideal for polishing automotive glass, windshields, and other critical glass
고순도 닦는 CEO2 파우더 슬러리 OLED 디스플레이
High Purity Polishing Slurry For OLED DisplaysDescriptionLichen High-Purity Polishing Slurry for OLED Displays is an advanced cerium oxide-based slurry designed to meet the demanding requirements of OLED display production. Engineered for ultra-smooth finishes, our slurry provides exceptional surface quality, critical for OLED panels, ensuring high optical performance, color accuracy, and long-term reliability.Our slurry is ideal for polishing the glass substrates and fine
