"rare earth metal"
耐候性外壁塗装用ナノセリウム酸化物
Nano Cerium Oxide for Outdoor Weather-Resistant Coatings Product Overview Nano Cerium Oxide is an advanced functional rare earth material designed to enhance the long-term performance of outdoor coating systems. Its outstanding UV absorption capability, oxygen storage capacity, and chemical stability help coatings maintain color retention, gloss, and structural integrity under prolonged exposure to sunlight, moisture, and harsh environmental conditions. The material is widely
ウェハー＆先端基板用半導体グレード酸化セリウム研磨粉
Semiconductor Grade Cerium Oxide Polishing Powder for Wafer & Advanced Substrates Product Overview Semiconductor Grade Cerium Oxide Polishing Powder is formulated for defect-sensitive polishing applications in semiconductor and advanced electronic substrate manufacturing. The controlled purity and particle engineering reduce contamination risks while ensuring consistent planarization performance. Optimized for preparation of CMP slurries used in semiconductor wafer processing
無水性ディスプロシウム粉末 ネオジミウム塩化物 原材料
Anhydrous Neodymium Chloride Molecular Formula: NdCl₃Appearance: Anhydrous neodymium chloride is a pink powdery crystal. Application: Used for producing metallic neodymium, as a raw material in the field of pharmaceutical catalysis or single crystal growth. Item Specification Testing Standard Grade NdCl₃-3N NdCl₃-3N5 NdCl₃-4N / TREO (wt%) ≥66.0 ≥66.0 ≥66.0 / Rare Earth Relative Purity (wt%) Refer to GB/T 18115.1 La₂O₃/TREO ≤0.02 ≤0.01 ≤0.001 CeO₂/TREO ≤0.02 ≤0.01 ≤0.001 Pr₆O₁
CMPセリウムオキシド 半導体ガラスウエファーのための磨き粉
Cerium Oxide Polishing Powder for Semiconductor Wafers Description Lichen Cerium Oxide Polishing Powder for Semiconductor Wafers is a high-purity, precision-engineered abrasive designed for wafer surface finishing and planarization processes. With tightly controlled particle size distribution and low metallic impurities, this polishing powder delivers uniform material removal, excellent surface smoothness, and low defect density, supporting the stringent requirements of
CMP セリウム ポリッシュ 粉 玻璃 ポリッシュ ためのセリウム オキシード シリコン ウェーファー
Polishing Powder for Silicon Wafer CMP Description Achieve the extreme planarity required for semiconductor nodes with our Advanced Cerium Oxide (CeO₂) Polishing Powders. Specifically engineered for Chemical Mechanical Planarization (CMP), our powders are designed for the high-volume manufacturing of silicon wafers, delivering the atomic-level smoothness essential for sub-7nm logic and 3D NAND memory architectures. Our formulations utilize precisely controlled particle
ODM セリウムオキシドベースの磨き粉末と化合物 磨き塗りスラム
Polishing Slurry for Ultra-Fine Electronics Surfaces Overview: Our Polishing Slurry for Ultra-Fine Electronics Surfaces is meticulously engineered to deliver precise, high-quality finishes for the most delicate electronics applications. With advanced cerium oxide-based technology, this slurry is designed for the polishing of ultra-fine surfaces in the electronics industry, ensuring smoothness, clarity, and minimal defects. Key Features: High Purity Cerium Oxide: Formulated
半導体ガラスのための精細平面化セリウム酸化物スラム
Slurry For Fine Planarization Of Semiconductor Glass Description Lichen Cerium-Based Polishing Slurry for Fine Planarization of Semiconductor Glass is a high-purity, ready-to-use slurry engineered for advanced glass planarization processes in semiconductor manufacturing. Formulated with precisely controlled cerium oxide particles, this slurry delivers excellent surface flatness, low roughness, and minimal defect generation, meeting the stringent requirements of modern
半導体ウエファー磨き用のカスタマイズされたセリウム磨き粉末ペスト
Polishing Powder For Ultra-Fine Wafer Polishing Description Lichen Cerium-Based Polishing Slurry for Fine Planarization of Semiconductor Glass is a high-purity, ready-to-use slurry engineered for advanced glass planarization processes in semiconductor manufacturing. Formulated with precisely controlled cerium oxide particles, this slurry delivers excellent surface flatness, low roughness, and minimal defect generation, meeting the stringent requirements of modern semiconducto
プラナライゼーション セリウムオキシド スラージー 半導体ガラス用 磨きパスタ
Cerium Oxide Slurry For Semiconductor Glass Substrates Description Lichen Cerium Oxide Slurry for Semiconductor Glass Substrates is a high-purity, water-based polishing slurry formulated specifically for semiconductor glass applications. This slurry provides excellent material removal rates, consistent surface finishes, and precise planarization, making it ideal for polishing semiconductor glass substrates used in wafer-level packaging, photomasks, and advanced integrated
2.2μM Ph 中性ポリシング CMP グラス・ウェーファー基板用スラム
CMP Slurry For Glass Wafer Substrates Description Lichen CMP Slurry for Glass Wafer Substrates is a high-purity, ready-to-use polishing slurry formulated for precision chemical-mechanical planarization (CMP) of glass wafer substrates. Designed for the advanced semiconductor, photonics, and microelectronics industries, this slurry ensures optimal material removal, uniform surface polishing, and low defect density, meeting the strict requirements for high-performance glass
OEM 自動車のフロントガラスのためのシオ2の磨き粉 Cas 1306-38-3
Polishing Powder For Automotive Glass And Windshields Description Lichen Cerium Oxide Polishing Powder for Automotive Glass and Windshields is a high-purity, fine-grade polishing material designed to deliver superior results in the automotive glass industry. Engineered for precision finishing, this cerium oxide polishing powder ensures high-quality surface smoothness, gloss, and clarity, making it ideal for polishing automotive glass, windshields, and other critical glass
高純度ポリシング Ceo2 パウダースラー OLEDディスプレイ
High Purity Polishing Slurry For OLED DisplaysDescriptionLichen High-Purity Polishing Slurry for OLED Displays is an advanced cerium oxide-based slurry designed to meet the demanding requirements of OLED display production. Engineered for ultra-smooth finishes, our slurry provides exceptional surface quality, critical for OLED panels, ensuring high optical performance, color accuracy, and long-term reliability.Our slurry is ideal for polishing the glass substrates and fine
