کیفیت CMP Cerium Oxide Polishing Powder For Semiconductor Glass Wafer کارخانه
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کیفیت CMP Cerium Oxide Polishing Powder For Semiconductor Glass Wafer کارخانه
کیفیت CMP Cerium Oxide Polishing Powder For Semiconductor Glass Wafer کارخانه
>

CMP Cerium Oxide Polishing Powder For Semiconductor Glass Wafer

نام تجاری: LICHEN
شماره مدل: LCR0103
مکان مبداء: چین
گواهینامه: ISO
حداقل مقدار سفارش: 20 کیلو گرم
قیمت: NEGOCIABLE
توانایی عرضه: 3000 تن در سال

جزئیات محصول


اندازه ذرات: 0.1-0.3μm Cas no.: 1306-38-3
مدیرعامل: 99% نرخ تعلیق: بالا
محدوده Ph: 7-10 کاربرد: ویفرهای نیمه هادی
برجسته کردن

Semiconductor Cerium Oxide Polishing Powder,Glass Wafer Cerium Oxide Polishing Powder,cmp wafer Polishing Powder

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Glass Wafer Cerium Oxide Polishing Powder

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cmp wafer Polishing Powder

توضیحات محصول

Cerium Oxide Polishing Powder for Semiconductor Wafers

Description

Lichen Cerium Oxide Polishing Powder for Semiconductor Wafers is a high-purity, precision-engineered abrasive designed for wafer surface finishing and planarization processes. With tightly controlled particle size distribution and low metallic impurities, this polishing powder delivers uniform material removal, excellent surface smoothness, and low defect density, supporting the stringent requirements of modern semiconductor manufacturing.

The product is suitable for glass wafers, oxide layers, and specialty semiconductor substrates, and can be used in both CMP-related processes and fine mechanical polishing stages.

 

Key Features & Advantages

Ultra-High Purity Cerium Oxide
Low metallic and ionic impurities help prevent wafer contamination and device defects.

Narrow Particle Size Distribution
Ensures uniform polishing action, reducing scratches, pits, and surface non-uniformity.

Stable Material Removal Rate
Provides predictable polishing performance for tight process control.

Low Defect Generation
Designed to minimize micro-scratches, haze, and surface damage.

Excellent Batch Consistency
Supports repeatable results in high-volume semiconductor production.

 

Tech Data

Molecular Formula CAS No. CeO₂ %  D50 (μm) Appearance Application
CeO2 1306-38-3 99% 0.1-0.3μm Polishing Powder Semiconductor Wafers

 

Particle Size Distribution

 

CMP Cerium Oxide Polishing Powder For Semiconductor Glass Wafer 0

Q&A

1. What is rare earth polishing powder?

Rare earth polishing powder is a high-purity compound used for polishing optical components, semiconductor wafers, and delicate surfaces like glass and lenses. It delivers a smooth, high-clarity finish without damaging the material.

2. How do I choose the right rare earth polishing powder for my application?

To select the ideal polishing powder, consider factors like the material you’re polishing, the required finish, and specifications like particle size and purity. Our sales team is available to help you choose the perfect product for your needs.

3. How should I store  rare earth polishing powder?

Store in a cool, dry place, away from moisture and direct sunlight. Keep the powder in airtight containers to prevent contamination and maintain its effectiveness. With proper storage, it typically lasts 1-2 years.

4. Do you provide customized rare earth formulations?

Yes, we offer custom rare earth polishing powders and slurries, tailored to meet your specific needs, including adjustments to particle size, chemical composition, or slurry consistency.

5. Can I get a sample before making a bulk order?

Absolutely! We provide samples for evaluation. Contact our team to request a sample, and we’ll arrange the shipment.

6. How can I place an order? What is the typical delivery time?

To place an order, simply contact our sales team, who will guide you through the process and provide a quote. Delivery times vary based on order size, location, and stock availability, and we’ll give you an estimated schedule once the order is confirmed.

 

نکات برجسته محصول

Cerium Oxide Polishing Powder for Semiconductor Wafers Description Lichen Cerium Oxide Polishing Powder for Semiconductor Wafers is a high-purity, precision-engineered abrasive designed for wafer surface finishing and planarization processes. With tightly controlled particle size distribution and ...

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