Qualidade CMP Cerium Oxide Polishing Powder For Semiconductor Glass Wafer Fábrica
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Qualidade CMP Cerium Oxide Polishing Powder For Semiconductor Glass Wafer Fábrica
Qualidade CMP Cerium Oxide Polishing Powder For Semiconductor Glass Wafer Fábrica
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CMP Cerium Oxide Polishing Powder For Semiconductor Glass Wafer

Nome da marca: LICHEN
Número do modelo: LCR0103
Lugar de origem: China
Certificação: ISO
Quantidade mínima do pedido: 20kg
Preço: NEGOCIABLE
Capacidade de abastecimento: 3000MT/year

Detalhes do produto


Tamanho de partícula: 00,1-0,3 μm Nº CAS.: 1306-38-3
CeO₂: 99% Taxa de Suspensão: Alto
Faixa de pH: 7-10 aplicativo: Bolachas semicondutoras
Destacar

Semiconductor Cerium Oxide Polishing Powder

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Glass Wafer Cerium Oxide Polishing Powder

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cmp wafer Polishing Powder

Descrição do produto

Cerium Oxide Polishing Powder for Semiconductor Wafers

Description

Lichen Cerium Oxide Polishing Powder for Semiconductor Wafers is a high-purity, precision-engineered abrasive designed for wafer surface finishing and planarization processes. With tightly controlled particle size distribution and low metallic impurities, this polishing powder delivers uniform material removal, excellent surface smoothness, and low defect density, supporting the stringent requirements of modern semiconductor manufacturing.

The product is suitable for glass wafers, oxide layers, and specialty semiconductor substrates, and can be used in both CMP-related processes and fine mechanical polishing stages.

 

Key Features & Advantages

Ultra-High Purity Cerium Oxide
Low metallic and ionic impurities help prevent wafer contamination and device defects.

Narrow Particle Size Distribution
Ensures uniform polishing action, reducing scratches, pits, and surface non-uniformity.

Stable Material Removal Rate
Provides predictable polishing performance for tight process control.

Low Defect Generation
Designed to minimize micro-scratches, haze, and surface damage.

Excellent Batch Consistency
Supports repeatable results in high-volume semiconductor production.

 

Tech Data

Molecular Formula CAS No. CeO₂ %  D50 (μm) Appearance Application
CeO2 1306-38-3 99% 0.1-0.3μm Polishing Powder Semiconductor Wafers

 

Particle Size Distribution

 

CMP Cerium Oxide Polishing Powder For Semiconductor Glass Wafer 0

Q&A

1. What is rare earth polishing powder?

Rare earth polishing powder is a high-purity compound used for polishing optical components, semiconductor wafers, and delicate surfaces like glass and lenses. It delivers a smooth, high-clarity finish without damaging the material.

2. How do I choose the right rare earth polishing powder for my application?

To select the ideal polishing powder, consider factors like the material you’re polishing, the required finish, and specifications like particle size and purity. Our sales team is available to help you choose the perfect product for your needs.

3. How should I store  rare earth polishing powder?

Store in a cool, dry place, away from moisture and direct sunlight. Keep the powder in airtight containers to prevent contamination and maintain its effectiveness. With proper storage, it typically lasts 1-2 years.

4. Do you provide customized rare earth formulations?

Yes, we offer custom rare earth polishing powders and slurries, tailored to meet your specific needs, including adjustments to particle size, chemical composition, or slurry consistency.

5. Can I get a sample before making a bulk order?

Absolutely! We provide samples for evaluation. Contact our team to request a sample, and we’ll arrange the shipment.

6. How can I place an order? What is the typical delivery time?

To place an order, simply contact our sales team, who will guide you through the process and provide a quote. Delivery times vary based on order size, location, and stock availability, and we’ll give you an estimated schedule once the order is confirmed.

 

Destaques do Produto

Cerium Oxide Polishing Powder for Semiconductor Wafers Description Lichen Cerium Oxide Polishing Powder for Semiconductor Wafers is a high-purity, precision-engineered abrasive designed for wafer surface finishing and planarization processes. With tightly controlled particle size distribution and ...

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