Silicon Wafer Glass Rare Earth Polishing Slurry Chemical Mechanical Planarization CeO2
Product Details
| Particle Size: | 1.0±0.2μm | CAS No.: | 1306-38-3 |
|---|---|---|---|
| CeO₂: | 99% | Suspension Rate: | High |
| PH Range: | 7-10 | Formulation: | Customized |
| Highlight |
Silicon Wafer Rare Earth Polishing Slurry,Planarization Rare Earth Polishing Slurry,Chemical Mechanical glass slurry |
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Product Description
Polishing Slurry for Silicon Wafer Polishing
Description
Achieve atomic-level planarity and superior surface integrity with our Series Cerium Oxide (CeO₂) Polishing Slurries. Specifically engineered for Chemical Mechanical Planarization (CMP) in advanced semiconductor manufacturing, our slurries are optimized for the transition to smaller process nodes.
By leveraging the unique chemical-mechanical synergy of high-purity ceria, our formulations deliver high material removal rates (MRR) while maintaining the ultra-low defectivity required for next-generation logic and memory devices.
Performance Excellence
Nanometer-Level Planarity: Engineered to produce ultra-smooth, high-gloss surfaces with root-mean-square roughness as low as 0.06 nm to 0.32 nm on silicon and dielectric films.
High Selectivity & Removal Rates: Optimized for Shallow Trench Isolation (STI) and Interlayer Dielectric (ILD) applications, delivering bulk oxide removal rates exceeding 500 nm/min.
Precision: Designed to meet stringent defectivity requirements for advanced technology nodes, minimizing surface scratching.
Advanced Suspension Stability: Proprietary particle engineering and stabilizers ensure uniform dispersion and prevent agglomeration, reducing the risk of micro-scratches caused by oversized particles.
Sustainable Resource Technology: Our formulations align with industry initiatives, offering improved resource efficiency and compatibility with recycling technologies to reduce total cost of ownership.
Tech Data
| Molecular Formula | CAS No. | CeO₂ % | D50 (μm) | Appearance | Application |
| CeO2 | 1306-38-3 | 99% | 1.0±0.2 | White Slurry | LCD Panel |
Q&A
1. What is rare earth polishing powder?
Rare earth polishing powder is a high-purity compound used for polishing optical components, semiconductor wafers, and delicate surfaces like glass and lenses. It delivers a smooth, high-clarity finish without damaging the material.
2. How do I choose the right rare earth polishing powder for my application?
To select the ideal polishing powder, consider factors like the material you’re polishing, the required finish, and specifications like particle size and purity. Our sales team is available to help you choose the perfect product for your needs.
3. How should I store rare earth polishing powder?
Store in a cool, dry place, away from moisture and direct sunlight. Keep the powder in airtight containers to prevent contamination and maintain its effectiveness. With proper storage, it typically lasts 1-2 years.
4. Do you provide customized rare earth formulations?
Yes, we offer custom rare earth polishing powders and slurries, tailored to meet your specific needs, including adjustments to particle size, chemical composition, or slurry consistency.
5. Can I get a sample before making a bulk order?
Absolutely! We provide samples for evaluation. Contact our team to request a sample, and we’ll arrange the shipment.
6. How can I place an order? What is the typical delivery time?
To place an order, simply contact our sales team, who will guide you through the process and provide a quote. Delivery times vary based on order size, location, and stock availability, and we’ll give you an estimated schedule once the order is confirmed.
Product Highlights
Polishing Slurry for Silicon Wafer Polishing Description Achieve atomic-level planarity and superior surface integrity with our Series Cerium Oxide (CeO₂) Polishing Slurries. Specifically engineered for Chemical Mechanical Planarization (CMP) in advanced semiconductor manufacturing, our slurries are ...
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Cerium Oxalate Powder Chemical Reagent Elements
Cerium oxalate is an oxalate salt of trivalent cerium and an important rare earth compound, often existing in the form of hydrate. 1. Basic Information English Name: Cerium(III) oxalate, Cerous oxalate Chemical Formula: (usually hydrate, where x is mostly 9 or 10) Molecular Weight (Anhydrous): 544.29 : Anhydrous: 139-42-4 Hydrate: 15750-47-7 2. Physical and Chemical Properties Appearance: White or pale yellow crystalline powder, odorless and tasteless. Solubility: Practically
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