Jakość OEM CMP Polishing Cerium Oxide Slurry Abrasive For Laser Optics Semiconductor Fabryka
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Jakość OEM CMP Polishing Cerium Oxide Slurry Abrasive For Laser Optics Semiconductor Fabryka
Jakość OEM CMP Polishing Cerium Oxide Slurry Abrasive For Laser Optics Semiconductor Fabryka
>

OEM CMP Polishing Cerium Oxide Slurry Abrasive For Laser Optics Semiconductor

Nazwa marki: LICHEN
Numer modelu: LC020S08
Miejsce pochodzenia: Chiny
Certyfikacja: ISO9001
Minimalna ilość zamówienia: 20 KGS
Cena £: NEGOCIABLE
Zdolność do zaopatrzenia: 3000MT/rok

Szczegóły produktu


Wielkość cząstek D50 (μm): 0,6-0,8µm Nr CAS: 1306-38-3
CeO₂%: 73 ~ 78% zawieszenie: Doskonały
Zakres pH: 7-10 Sformułowanie: Dostosowane
Podkreślić

cerium oxide slurry abrasive

,

CMP cerium oxide slurry

,

Cerium semiconductor slurry

Opis produktu

Customized Polishing Slurry for Laser Optics

Description

Achieve pristine, defect-free optical surfaces with our advanced, customized cerium-based polishing slurries, specifically engineered for the demanding requirements of high-performance laser optics.

Our formulations utilize high-purity cerium oxide (CeO₂) as the primary abrasive, leveraging its unique chemical-mechanical polishing (CMP) properties to deliver exceptional surface finishes, increased productivity, and minimized subsurface damage. 

 

Key Benefits

Finishes: Consistently achieve angstrom-level surface roughness crucial for minimizing light scatter and maximizing performance in high-power laser systems.

Optimized for Laser Materials: Formulations are specifically tailored for a wide range of optical substrates.

Rapid Material Removal: Engineered for high stock removal rates, significantly increasing your polishing throughput and reducing processing times without compromising surface quality.

High Stability & Easy Use: Our slurries feature superior suspension characteristics, ensuring uniform particle dispersion, minimal settling, and easy cleanup with water after use.

Custom Formulations: We collaborate closely with your team to develop a bespoke solution that precisely matches your specific application requirements, pad materials, and equipment type.

 

Tech Data

Molecular Formula CAS No. CeO₂ %  D50 (μm) Appearance Application
CeO2 1306-38-3 73~78% 0.6-0.8 Slurry Optics

 

Particle Size Distribution

OEM CMP Polishing Cerium Oxide Slurry Abrasive For Laser Optics Semiconductor 0

Q&A

1. Do you provide customized Polishing Slurry  formulations?

Yes, we offer customized  polishing powders and slurries tailored to meet specific performance requirements. Whether you need adjustments to particle size, chemical composition, or slurry consistency, we can create a formulation that best suits your needs.

2. Can I get a sample before making a bulk order?

Yes, we provide samples of our cerium oxide polishing powder and slurry for evaluation. Please contact us to request a sample, and our team will arrange the shipment.

3. How can I place an order? What is the typical delivery time for Polishing Slurry products?

You can place an order by contacting our sales team. We will guide you through the process, help with product selection, and provide you with a quote based on your needs. We’ll provide an estimated delivery schedule once the order is confirmed. Delivery times depend on the order size, location, and whether the product is in stock.

Najważniejsze cechy produktu

Customized Polishing Slurry for Laser Optics Description Achieve pristine, defect-free optical surfaces with our advanced, customized cerium-based polishing slurries, specifically engineered for the demanding requirements of high-performance laser optics. Our formulations utilize high-purity cerium ...

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