CMP Cerium Polish Powder Cerium Oxide For Glass Polishing Silicon Wafer
Product Details
| Particle Size: | 1.5±0.2μm | CAS No.: | 1306-38-3 |
|---|---|---|---|
| CeO₂: | 99% | Suspension Rate: | High |
| PH Range: | 7-10 | Formulation: | Customized |
| Highlight |
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Product Description
Polishing Powder for Silicon Wafer CMP
Description
Achieve the extreme planarity required for semiconductor nodes with our Advanced Cerium Oxide (CeO₂) Polishing Powders. Specifically engineered for Chemical Mechanical Planarization (CMP), our powders are designed for the high-volume manufacturing of silicon wafers, delivering the atomic-level smoothness essential for sub-7nm logic and 3D NAND memory architectures.
Our formulations utilize precisely controlled particle morphology to maximize the chemical-mechanical synergy, ensuring high material removal rates (MRR) while minimizing surface defectivity.
Performance Benchmarks
Planarity: Engineered to achieve surface roughness values below 0.2 nm, providing a perfectly flat foundation for multi-layer thin-film deposition.
High Selectivity Control: Optimized for Shallow Trench Isolation (STI), offering superior selectivity between silicon dioxide to prevent dishing and erosion of critical device features.
Nano-Defect Reduction: Through advanced multi-stage classification, we ensure a monodisperse particle size distribution that virtually eliminates micro-scratches and pits.
High Stock Removal Efficiency: Our powders feature high-activity ceria surfaces that accelerate the formation of thei chemical bond, increasing throughput in 300mm wafer fabs.
High Purity (>99%): Refined to meet stringent cleanroom standards, preventing trace-metal contamination that can degrade electrical performance and gate oxide integrity.
Tech Data
| Molecular Formula | CAS No. | CeO₂ % | D50 (μm) | Appearance | Application |
| CeO2 | 1306-38-3 | 99% | 1.5±0.2 | White Powder | Silicon Wafer |
Q&A
1. What is rare earth polishing powder?
Rare earth polishing powder is a high-purity compound used for polishing optical components, semiconductor wafers, and delicate surfaces like glass and lenses. It delivers a smooth, high-clarity finish without damaging the material.
2. How do I choose the right rare earth polishing powder for my application?
To select the ideal polishing powder, consider factors like the material you’re polishing, the required finish, and specifications like particle size and purity. Our sales team is available to help you choose the perfect product for your needs.
3. How should I store rare earth polishing powder?
Store in a cool, dry place, away from moisture and direct sunlight. Keep the powder in airtight containers to prevent contamination and maintain its effectiveness. With proper storage, it typically lasts 1-2 years.
4. Do you provide customized rare earth formulations?
Yes, we offer custom rare earth polishing powders and slurries, tailored to meet your specific needs, including adjustments to particle size, chemical composition, or slurry consistency.
5. Can I get a sample before making a bulk order?
Absolutely! We provide samples for evaluation. Contact our team to request a sample, and we’ll arrange the shipment.
6. How can I place an order? What is the typical delivery time?
To place an order, simply contact our sales team, who will guide you through the process and provide a quote. Delivery times vary based on order size, location, and stock availability, and we’ll give you an estimated schedule once the order is confirmed.
Product Highlights
Polishing Powder for Silicon Wafer CMP Description Achieve the extreme planarity required for semiconductor nodes with our Advanced Cerium Oxide (CeO₂) Polishing Powders. Specifically engineered for Chemical Mechanical Planarization (CMP), our powders are designed for the high-volume manufacturing ...
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Cerium Oxalate Powder Chemical Reagent Elements
Cerium oxalate is an oxalate salt of trivalent cerium and an important rare earth compound, often existing in the form of hydrate. 1. Basic Information English Name: Cerium(III) oxalate, Cerous oxalate Chemical Formula: (usually hydrate, where x is mostly 9 or 10) Molecular Weight (Anhydrous): 544.29 : Anhydrous: 139-42-4 Hydrate: 15750-47-7 2. Physical and Chemical Properties Appearance: White or pale yellow crystalline powder, odorless and tasteless. Solubility: Practically
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