Quality Nano Ceria CMP Slurry 100nm | High-Performance Cerium Oxide CMP Slurry For Semiconductor factory
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Quality Nano Ceria CMP Slurry 100nm | High-Performance Cerium Oxide CMP Slurry For Semiconductor factory
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Nano Ceria CMP Slurry 100nm | High-Performance Cerium Oxide CMP Slurry For Semiconductor

Brand Name: LICHEN
Model Number: LC
Place of Origin: CHINA
Certification: ISO
Minimum Order Quantity: 20KGS
Price: NEGOCIABLE
Supply Ability: 3000MT/YEAR

Product Details


Particle Size: 100nm CAS No.: 1306-38-3
CeO₂: 99% Solid Content: 20 Wt% (Customizable)
PH Range: Adjustable Application: Semiconductor
Highlight

Nano Ceria CMP Slurry 100nm

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Cerium Oxide CMP Slurry semiconductor

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Rare Earth Polishing Slurry high-performance

Product Description


Nano Ceria CMP Slurry 100nm | High-Performance Cerium Oxide CMP Slurry For Semiconductor

Description

Nano Ceria CMP Slurry (100 nm) is a high-performance chemical mechanical polishing (CMP) material formulated using ultra-fine nanometer cerium oxide particles. The slurry is engineered for high-precision planarization, defect control, and superior surface quality required in semiconductor manufacturing.

Through optimized particle size distribution and controlled surface chemistry, the slurry delivers:

  • Stable polishing performance
  • High material removal efficiency
  • Excellent surface smoothness
  • Reduced micro-scratches and defects

It is ideal for next-generation precision polishing processes demanding nanometer-level surface control.

 

Key Features & Advantages

High-Purity Abrasive Materials

Low impurity content ensures clean polishing behavior and optical-grade surface quality.

Controlled Particle Size Distribution

Provides uniform material removal and minimizes micro-scratches and surface defects.

Stable Polishing Performance

Consistent abrasive characteristics support repeatable results across production batches.

Versatile Application Range

Suitable for a wide variety of optical glass compositions and polishing processes.

Process & Equipment Compatibility

Designed for use with standard optical polishing machines, pads, and tooling.

 

Particle Size Distribution


Nano Ceria CMP Slurry 100nm | High-Performance Cerium Oxide CMP Slurry For Semiconductor

Q&A

1. What is rare earth polishing powder?

Rare earth polishing powder is a high-purity compound used for polishing optical components, semiconductor wafers, and delicate surfaces like glass and lenses. It delivers a smooth, high-clarity finish without damaging the material.

2. How do I choose the right rare earth polishing powder for my application?

To select the ideal polishing powder, consider factors like the material you’re polishing, the required finish, and specifications like particle size and purity. Our sales team is available to help you choose the perfect product for your needs.

3. How should I store  rare earth polishing powder?

Store in a cool, dry place, away from moisture and direct sunlight. Keep the powder in airtight containers to prevent contamination and maintain its effectiveness. With proper storage, it typically lasts 1-2 years.

4. Do you provide customized rare earth formulations?

Yes, we offer custom rare earth polishing powders and slurries, tailored to meet your specific needs, including adjustments to particle size, chemical composition, or slurry consistency.

5. Can I get a sample before making a bulk order?

Absolutely! We provide samples for evaluation. Contact our team to request a sample, and we’ll arrange the shipment.

6. How can I place an order? What is the typical delivery time?

To place an order, simply contact our sales team, who will guide you through the process and provide a quote. Delivery times vary based on order size, location, and stock availability, and we’ll give you an estimated schedule once the order is confirmed.

Product Highlights

Nano Ceria CMP Slurry 100nm | High-Performance Cerium Oxide CMP Slurry For Semiconductor Description Nano Ceria CMP Slurry (100 nm) is a high-performance chemical mechanical polishing (CMP) material formulated using ultra-fine nanometer cerium oxide particles. The slurry is engineered for high...

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