Nano Ceria CMP Slurry | Ultra-Fine Cerium Oxide Slurry For High-Precision Semiconductor & Optical Polishing
Product Details
| Particle Size Distribution: | Narrow Distribution | CAS No.: | 1306-38-3 |
|---|---|---|---|
| CeO₂: | 99% | Solid Content: | 20 Wt% |
| PH Value: | Adjustable | Product Type: | Nano Cerium Oxide CMP Slurry |
| Highlight |
Nano Ceria CMP slurry for semiconductors,Ultra-fine cerium oxide polishing slurry,High-precision optical polishing CMP slurry |
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Product Description
Nano Ceria CMP Slurry | Ultra-Fine Cerium Oxide Slurry For High-Precision Semiconductor & Optical Polishing
Description
Nano Ceria CMP Slurry is a high-purity cerium oxide polishing slurry specifically developed for advanced Chemical Mechanical Planarization (CMP) applications requiring precise material removal and superior surface quality. Formulated with uniformly dispersed nano-scale ceria particles, the slurry delivers an optimal balance between chemical activity and mechanical polishing performance.
The nano cerium oxide particles provide controlled polishing action, enabling high removal efficiency while effectively minimizing micro-scratches, surface defects, and subsurface damage. The optimized positive surface charge and narrow particle size distribution ensure excellent dispersion stability, preventing agglomeration and maintaining consistent polishing performance during long production cycles.
Designed for modern precision manufacturing environments, the slurry supports highly stable CMP processes across semiconductor wafers, precision optical components, advanced glass substrates, and electronic materials. Its carefully engineered formulation improves planarization uniformity, enhances surface smoothness, and contributes to higher device yield and reliability.
Typical Applications
Semiconductor Manufacturing
Silicon wafer CMP
Oxide layer planarization
Precision Optical Components
Optical lenses
Laser optics
Photonic components
High-precision glass substrates
Advanced Glass & Display Industry
Cover glass polishing
Display panels
Sapphire and specialty glass finishing
Electronic Materials
Ceramic substrates
Hard brittle materials
Functional thin film polishing
Particle Size Distribution

Q&A
1. What is rare earth polishing powder?
Rare earth polishing powder is a high-purity compound used for polishing optical components, semiconductor wafers, and delicate surfaces like glass and lenses. It delivers a smooth, high-clarity finish without damaging the material.
2. How do I choose the right rare earth polishing powder for my application?
To select the ideal polishing powder, consider factors like the material you’re polishing, the required finish, and specifications like particle size and purity. Our sales team is available to help you choose the perfect product for your needs.
3. How should I store rare earth polishing powder?
Store in a cool, dry place, away from moisture and direct sunlight. Keep the powder in airtight containers to prevent contamination and maintain its effectiveness. With proper storage, it typically lasts 1-2 years.
4. Do you provide customized rare earth formulations?
Yes, we offer custom rare earth polishing powders and slurries, tailored to meet your specific needs, including adjustments to particle size, chemical composition, or slurry consistency.
5. Can I get a sample before making a bulk order?
Absolutely! We provide samples for evaluation. Contact our team to request a sample, and we’ll arrange the shipment.
6. How can I place an order? What is the typical delivery time?
To place an order, simply contact our sales team, who will guide you through the process and provide a quote. Delivery times vary based on order size, location, and stock availability, and we’ll give you an estimated schedule once the order is confirmed.
Product Highlights
Nano Ceria CMP Slurry | Ultra-Fine Cerium Oxide Slurry For High-Precision Semiconductor & Optical Polishing Description Nano Ceria CMP Slurry is a high-purity cerium oxide polishing slurry specifically developed for advanced Chemical Mechanical Planarization (CMP) applications requiring precise ...
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