Chemical Mechanical Planarization CMP Cerium Oxide Polishing Powder Lapidary

Polishing Powder For Chemical Mechanical Planarization (CMP) Process

Description

Lichen Polishing Powder for Chemical Mechanical Planarization (CMP) is a high-performance cerium oxide-based polishing powder designed to deliver superior surface planarization and precision polishing in semiconductor wafer processing. Our polishing powder is specifically formulated to enhance material removal rates, ensuring uniformity and flatness during the CMP process, which is crucial for achieving optimal surface finishes in advanced semiconductor devices.

CMP is essential for wafer-level processing of semiconductor materials, such as silicon and compound semiconductors. Lichen’s polishing powder ensures high-precision planarization, offering controlled polishing action that achieves low surface roughness, high flatness, and reduced defects, making it ideal for subsequent photolithography, thin-film deposition, and etching steps.

Key Features & Advantages

High-Purity Cerium Oxide

Our polishing powder is made from ultra-pure cerium oxide, ensuring minimal impurities during the CMP process. This contributes to the high-quality surface finishes required for critical semiconductor applications, reducing the risk of contamination.

Optimized for CMP Process

Specifically formulated for the Chemical Mechanical Planarization (CMP) process, this polishing powder delivers consistent material removal, uniform surface flattening, and precise defect control across a variety of semiconductor wafer types.

Controlled Material Removal

Lichen’s CMP polishing powder ensures precise material removal rates (MRR), offering consistent, reliable surface planarity while maintaining wafer integrity. The slurry allows for uniform polishing across large wafer surfaces, ensuring flatness that meets industry standards.

Low Surface Roughness and High Flatness

Designed to reduce surface roughness, our powder ensures that semiconductor wafers achieve smooth, defect-free surfaces suitable for subsequent device processing. This makes it ideal for achieving high-performance semiconductor devices with excellent yield.

Tailored Solutions for Various Wafer Types

Lichen’s polishing powder can be customized to meet the specific needs of different wafer materials, thicknesses, and CMP process parameters, ensuring that each wafer meets the desired surface specifications.

Tech Data

Particle Size Distribution

Q&A

1. What is rare earth polishing powder?

Rare earth polishing powder is a high-purity compound used for polishing optical components, semiconductor wafers, and delicate surfaces like glass and lenses. It delivers a smooth, high-clarity finish without damaging the material.

2. How do I choose the right rare earth polishing powder for my application?

To select the ideal polishing powder, consider factors like the material you’re polishing, the required finish, and specifications like particle size and purity. Our sales team is available to help you choose the perfect product for your needs.

3. How should I store  rare earth polishing powder?

Store in a cool, dry place, away from moisture and direct sunlight. Keep the powder in airtight containers to prevent contamination and maintain its effectiveness. With proper storage, it typically lasts 1-2 years.

4. Do you provide customized rare earth formulations?

Yes, we offer custom rare earth polishing powders and slurries, tailored to meet your specific needs, including adjustments to particle size, chemical composition, or slurry consistency.

5. Can I get a sample before making a bulk order?

Absolutely! We provide samples for evaluation. Contact our team to request a sample, and we’ll arrange the shipment.

6. How can I place an order? What is the typical delivery time?

To place an order, simply contact our sales team, who will guide you through the process and provide a quote. Delivery times vary based on order size, location, and stock availability, and we’ll give you an estimated schedule once the order is confirmed.