Semiconductor Grade Cerium Oxide Polishing Powder for Wafer & Advanced Substrates
Product Details
| Purity: | ≥ 99.9% | D50: | 0.2 – 0.6 µm |
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| Surface Finish Capability: | Nanometer Level | PH (15% Suspension): | 6.5 – 8.5 |
| Appearance: | Light Yellow Powder | Dispersion Stability: | High |
| Highlight |
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Product Description
Semiconductor Grade Cerium Oxide Polishing Powder for Wafer & Advanced Substrates
Product Overview
Semiconductor Grade Cerium Oxide Polishing Powder is formulated for defect-sensitive polishing applications in semiconductor and advanced electronic substrate manufacturing. The controlled purity and particle engineering reduce contamination risks while ensuring consistent planarization performance.
Optimized for preparation of CMP slurries used in semiconductor wafer processing.
Key Features
- Ultra-high purity material
- Low metallic impurity levels
- Excellent dispersion in CMP slurry formulation
- Controlled removal rate
- Reduced scratch and defect formation
- Stable polishing performance
Particle Size Distribution
Applications
- Silicon wafer polishing
- Semiconductor substrate preparation
- Compound semiconductor materials
- Advanced packaging substrates
- Electronic and microelectronic polishing
Frequently Asked Questions
Q1. What is the difference between cerium oxide polishing powder grades?
Cerium oxide polishing powders are designed for different polishing stages and materials.
Selecting the proper grade depends on substrate material, required surface roughness, and polishing process conditions.
Q2. Which materials can be polished using cerium oxide polishing powder?
Cerium oxide polishing powder is widely used in advanced manufacturing industries and is suitable for:
- Optical glass and fused silica
- Sapphire and laser crystals
- Photonics components
- Silicon wafers
- Semiconductor substrates
- Precision optical and laser elements
Its chemical-mechanical polishing mechanism enables excellent surface finishing with minimal subsurface damage.
Q3. Can cerium oxide polishing powder be customized for specific polishing processes?
Yes. Cerium oxide polishing powder can be tailored according to customer requirements, including:
- Particle size distribution
- Removal rate performance
- Surface finish targets
- Slurry preparation concentration
- Application-specific formulations
Technical support and sample evaluation are typically available to optimize polishing performance for different equipment and materials.
Product Highlights
Semiconductor Grade Cerium Oxide Polishing Powder for Wafer & Advanced Substrates Product Overview Semiconductor Grade Cerium Oxide Polishing Powder is formulated for defect-sensitive polishing applications in semiconductor and advanced electronic substrate manufacturing. The controlled purity and ...
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