Scratch-Free Ceria CMP Slurry for Semiconductor & Silicon Wafer Polishing
Product Details
| Abrasive Material: | CeO₂ | Particle Size (D50): | 80 – 200 Nm |
|---|---|---|---|
| Solid Content: | 5 – 30 Wt% | PH: | 6.5 – 8.5 |
| Appearance: | White Slurry | Dispersion Stability: | High |
| Highlight |
Ceria CMP slurry for semiconductor polishing,Scratch-free polishing slurry for silicon wafers,Rare earth CMP slurry with warranty |
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Product Description
Scratch-Free Ceria CMP Slurry for Semiconductor & Silicon Wafer Polishing
Product Overview
Scratch-Free Cerium Oxide CMP Slurry is specially formulated for semiconductor wafer and advanced substrate polishing where defect control and ultra-smooth surfaces are critical. The engineered nano-scale ceria particles provide superior defect reduction while maintaining stable removal efficiency.
Ideal for silicon wafer finishing and precision semiconductor fabrication processes.
Key Features
- Ultra-low scratch and defect generation
- High planarization efficiency
- Excellent wafer surface uniformity
- Reduced micro-scratches and pits
- Low particle agglomeration technology
- Suitable for advanced CMP platforms
Particle Size Distribution
Applications
- Precision optical lenses polishing
- Photonics substrates and optical glass finishing
- Laser crystal surface planarization
- Camera optics and imaging systems
- Prism and mirror polishing
- Optical communication components
Frequently Asked Questions
Q1. What is Cerium Oxide CMP slurry used for?
Cerium Oxide CMP slurry is a chemical-mechanical polishing material designed for ultra-precision surface finishing. It combines mechanical abrasion and chemical interaction to achieve high material removal efficiency while maintaining excellent surface smoothness.
Q2. How do I select the correct ceria slurry for my application?
Selection mainly depends on material type and process target.
Our technical team can assist in optimizing slurry selection based on polishing machine, pad type, and surface quality requirements.
Q3. What materials can be polished using cerium oxide slurry?
Cerium oxide CMP slurry is suitable for a wide range of advanced materials:
- Optical glass
- Sapphire
- Silicon wafers
- Laser crystals (YAG, etc.)
- Photonic substrates
- Compound semiconductor materials
Product Highlights
Scratch-Free Ceria CMP Slurry for Semiconductor & Silicon Wafer Polishing Product Overview Scratch-Free Cerium Oxide CMP Slurry is specially formulated for semiconductor wafer and advanced substrate polishing where defect control and ultra-smooth surfaces are critical. The engineered nano-scale ...
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