High Removal Rate Cerium Oxide Polishing Powder for Optical Glass Processing
Product Details
| Purity: | ≥ 99.9% | D50: | 1.0 – 2.5 µm |
|---|---|---|---|
| Surface Finish Capability: | Sub-nanometer Level | PH (15% Suspension): | 6.5 – 8.5 |
| Appearance: | Light Yellow Powder | Dispersion Stability: | High |
| Highlight |
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Product Description
High Removal Rate Cerium Oxide Polishing Powder for Optical Glass Processing
Product Overview
High Removal Rate Cerium Oxide Polishing Powder is engineered for efficient polishing of optical glass components requiring fast material removal and stable surface quality. The optimized particle morphology provides excellent chemical-mechanical interaction with glass substrates, enabling improved productivity without compromising surface finish.
Designed for large-scale precision optics manufacturing and photonics component processing.
Key Features
- High material removal efficiency
- Excellent polishing uniformity
- Stable particle size distribution
- Reduced polishing time and cost
- Good suspension behavior in slurry preparation
- Suitable for batch and automated polishing systems
Particle Size Distribution
Applications
- Optical lenses and prisms polishing
- Camera and imaging optics manufacturing
- Photonics glass substrates
- Display and precision glass finishing
- Optical communication components
- General optical glass polishing
Frequently Asked Questions
Q1. What is the difference between cerium oxide polishing powder grades?
Cerium oxide polishing powders are designed for different polishing stages and materials.
Selecting the proper grade depends on substrate material, required surface roughness, and polishing process conditions.
Q2. Which materials can be polished using cerium oxide polishing powder?
Cerium oxide polishing powder is widely used in advanced manufacturing industries and is suitable for:
- Optical glass and fused silica
- Sapphire and laser crystals
- Photonics components
- Silicon wafers
- Semiconductor substrates
- Precision optical and laser elements
Its chemical-mechanical polishing mechanism enables excellent surface finishing with minimal subsurface damage.
Q3. Can cerium oxide polishing powder be customized for specific polishing processes?
Yes. Cerium oxide polishing powder can be tailored according to customer requirements, including:
- Particle size distribution
- Removal rate performance
- Surface finish targets
- Slurry preparation concentration
- Application-specific formulations
Technical support and sample evaluation are typically available to optimize polishing performance for different equipment and materials.
Product Highlights
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