High Removal Rate Cerium Oxide CMP Slurry for Optical Glass & Photonics Components
Produktdetails
| Schleifmittel: | CeO2 | Partikelgröße (D50): | 0,3 – 0,8 µm |
|---|---|---|---|
| solider Inhalt: | 5 – 20 Gew.-% | pH-Wert: | 6,5 – 8,5 |
| Aussehen: | Weiße Gülle | Stabilität der Dispersion: | Exzellent |
| Hervorheben |
cerium oxide CMP slurry for optical glass,high removal rate polishing slurry,rare earth CMP slurry for photonics |
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Produkt-Beschreibung
High Removal Rate Cerium Oxide CMP Slurry for Optical Glass & Photonics Components
Product Overview
High Removal Rate Cerium Oxide CMP Slurry is engineered for precision polishing of optical glass and photonic components requiring fast material removal with controlled surface quality. The optimized particle morphology enables efficient planarization while maintaining excellent surface integrity and process stability.
Designed for advanced optical manufacturing, this slurry supports high-throughput production of lenses, prisms, laser optics, and photonic substrates.
Key Features
- High material removal rate for improved productivity
- Excellent surface smoothness and low subsurface damage
- Stable dispersion with minimized agglomeration
- Scratch-free polishing performance
- Compatible with automated CMP and optical polishing systems
- Long slurry lifetime and stable pH control
Particle Size Distribution
Applications
- Precision optical lenses polishing
- Photonics substrates and optical glass finishing
- Laser crystal surface planarization
- Camera optics and imaging systems
- Prism and mirror polishing
- Optical communication components
Frequently Asked Questions
Q1. What is Cerium Oxide CMP slurry used for?
Cerium Oxide CMP slurry is a chemical-mechanical polishing material designed for ultra-precision surface finishing. It combines mechanical abrasion and chemical interaction to achieve high material removal efficiency while maintaining excellent surface smoothness.
Q2. How do I select the correct ceria slurry for my application?
Selection mainly depends on material type and process target.
Our technical team can assist in optimizing slurry selection based on polishing machine, pad type, and surface quality requirements.
Q3. What materials can be polished using cerium oxide slurry?
Cerium oxide CMP slurry is suitable for a wide range of advanced materials:
- Optical glass
- Sapphire
- Silicon wafers
- Laser crystals (YAG, etc.)
- Photonic substrates
- Compound semiconductor materials
Produkt-Highlights
High Removal Rate Cerium Oxide CMP Slurry for Optical Glass & Photonics Components Product Overview High Removal Rate Cerium Oxide CMP Slurry is engineered for precision polishing of optical glass and photonic components requiring fast material removal with controlled surface quality. The optimized ...
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