High-Purity Cerium Oxide Polishing Powder for TFT-LCD Glass Substrates
Detalhes do produto
| Pureza CeO₂: | ≥99,9% | TREO: | ≥99,0% |
|---|---|---|---|
| Tamanho de partícula D50: | 0,8–1,5 μm | Aparência: | Pó Amarelo Claro |
| pH (pasta): | 6-9 | Embalagem: | Personalizado |
| Destacar |
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Descrição do produto
High-Purity Cerium Oxide Polishing Powder for TFT-LCD Glass Substrates
Product Overview
High-purity cerium oxide polishing powder designed for ultra-precision finishing of TFT-LCD glass substrates. It delivers excellent material removal control, superior surface flatness, and minimal micro-scratches, making it suitable for advanced display manufacturing environments.
Key Features
- Ultra-high purity ceria formulation
- Excellent removal rate with controlled surface roughness
- Low defect (scratch/dig) performance
- Stable particle size distribution for consistent polishing
- Compatible with automated CMP (Chemical Mechanical Polishing) systems
Particle Size Distribution
Applications
- TFT-LCD glass substrate polishing
- Flat panel display (FPD) manufacturing
- Optical-grade glass finishing
- Semiconductor display components
Frequently Asked Questions
Q: Why is cerium oxide used in TFT-LCD polishing?
A: It provides a unique chemical-mechanical interaction with silica-based glass, enabling high efficiency and low-defect polishing.
Q: Can particle size be customized?
A: Yes, particle distribution can be tailored based on process requirements.
Destaques do Produto
High-Purity Cerium Oxide Polishing Powder for TFT-LCD Glass Substrates Product Overview High-purity cerium oxide polishing powder designed for ultra-precision finishing of TFT-LCD glass substrates. It delivers excellent material removal control, superior surface flatness, and minimal micro-scratches...
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High-Purity Cerium Oxide Polishing Powder for TFT-LCD Glass Substrates
High-Purity Cerium Oxide Polishing Powder for TFT-LCD Glass Substrates Product Overview High-purity cerium oxide polishing powder designed for ultra-precision finishing of TFT-LCD glass substrates. It delivers excellent material removal control, superior surface flatness, and minimal micro-scratches...
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