Alumina CMP Slurry | High-Performance Aluminum Oxide Slurry For Semiconductor Chemical Mechanical Planarization
Product Details
| D50: | 50 – 300 Nm | PH: | 3 – 11 |
|---|---|---|---|
| Solid Content: | 5 – 25 | Particle Distribution: | Narrow PSD |
| Dispersion Stability: | Excellent | Defect Performance: | Low Scratch Rate |
| Highlight |
Alumina CMP slurry for semiconductors,High-performance aluminum oxide slurry,Chemical mechanical planarization slurry |
||
Product Description
Alumina CMP Slurry | High-Performance Aluminum Oxide Slurry For Semiconductor Chemical Mechanical Planarization
Overview:
High-purity alumina CMP slurry designed for semiconductor wafer planarization. Stable dispersion, controllable removal rate, and excellent surface uniformity for advanced CMP processes.
Key Features & Advantages
Excellent Planarization Performance
Provides uniform material removal and superior surface flatness required in semiconductor fabrication.
Controlled Removal Rate
Optimized abrasive and chemical balance enables precise polishing control for different wafer materials.
Low Defect Generation
High dispersion stability minimizes particle agglomeration, reducing scratches and defects.
Stable CMP Operation
Maintains consistent slurry performance during long polishing cycles and automated production.
High Process Compatibility
Suitable for various CMP platforms and polishing pad systems.
Particle Size Distribution
Typical Applications
Semiconductor Manufacturing
- Silicon wafer CMP
- Oxide layer planarization
- Metal layer polishing
- Interlayer dielectric polishing
Q&A
1. Can I get a sample before making a bulk order?
Absolutely! We provide samples for evaluation. Contact our team to request a sample, and we’ll arrange the shipment.
2. How can I place an order? What is the typical delivery time?
To place an order, simply contact our sales team, who will guide you through the process and provide a quote. Delivery times vary based on order size, location, and stock availability, and we’ll give you an estimated schedule once the order is confirmed.
Product Highlights
Alumina CMP Slurry | High-Performance Aluminum Oxide Slurry For Semiconductor Chemical Mechanical Planarization Overview: High-purity alumina CMP slurry designed for semiconductor wafer planarization. Stable dispersion, controllable removal rate, and excellent surface uniformity for advanced CMP ...
CMP-Grade Ceria Polishing Powder For AR Optics, Micro-Lens Arrays & Wearable Optical Sensors
CMP-Grade Ceria Polishing Powder For AR Optics, Micro-Lens Arrays & Wearable Optical Sensors Product Overview This CMP-grade ceria polishing powder is engineered for next-generation micro-optical components used in AR wearables, optical sensors, and miniaturized imaging systems. Featuring controlled reactivity and ultra-fine particle engineering, the product enables atomic-level surface finishing required for high-resolution optical performance and advanced photonics
Ultra-Fine Ceria Oxide Polishing Powder For Smart Wearable Cover Glass & Micro-Optics Finishing
Ultra-Fine Ceria Oxide Polishing Powder For Smart Wearable Cover Glass & Micro-Optics Finishing Product Overview Developed for high-volume wearable electronics production, this ultra-fine cerium oxide polishing powder enables superior finishing of smartwatch cover glass, AR headset lenses, camera windows, and micro-optical assemblies. The formulation balances chemical activity and mechanical abrasion to deliver mirror-grade surfaces while maintaining high throughput in
High Purity Cerium Oxide Polishing Powder For AR Waveguide Glass & Optical Lens Manufacturing
High Purity Cerium Oxide Polishing Powder For AR Waveguide Glass & Optical Lens Manufacturing Product Overview This high-purity ceria polishing powder is specially engineered for ultra-precision polishing of AR waveguide optics, smart glasses lenses, and advanced wearable optical modules. Designed for next-generation augmented reality manufacturing, the product delivers controlled chemical-mechanical polishing (CMP) performance, achieving exceptional surface flatness and
Cerium Oxalate Powder Chemical Reagent Elements
Cerium oxalate is an oxalate salt of trivalent cerium and an important rare earth compound, often existing in the form of hydrate. 1. Basic Information English Name: Cerium(III) oxalate, Cerous oxalate Chemical Formula: (usually hydrate, where x is mostly 9 or 10) Molecular Weight (Anhydrous): 544.29 : Anhydrous: 139-42-4 Hydrate: 15750-47-7 2. Physical and Chemical Properties Appearance: White or pale yellow crystalline powder, odorless and tasteless. Solubility: Practically
Please use our online inquiry contact form below if you have any questions, our team will get back to you as soon as possible.
