Ultra-Fine Cerium Oxide Polishing Powder For Semiconductor And Precision Optics Finishing
Product Details
| Purity: | ≥99.99% | Agglomeration Control: | Low |
|---|---|---|---|
| Median Particle Size: | 0.3 – 0.6 μm | PH (Slurry Preparation): | 6.5 – 7.5 |
| Surface Roughness Achievable: | Sub-nanometer Level | Compatibility: | CMP Polishing Systems |
| Highlight |
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Product Description
Ultra-Fine Cerium Oxide Polishing Powder For Semiconductor And Precision Optics Finishing
Product Overview
Designed for advanced semiconductor and ultra-precision optical finishing, this ultra-fine ceria polishing powder provides exceptional surface planarization and defect minimization. The optimized particle engineering supports next-generation polishing requirements in high-accuracy optical and wafer processing environments.
Suitable for high-end semiconductor, aerospace optics, and metrology applications.
Particle Size Distribution
Applications
- Semiconductor wafer polishing
- Silicon wafer finishing
- High-precision mirrors
- Aerospace optics
- Metrology and inspection optics
Why Choose Lichen as Your Global Supplier
- Dedicated ceria & alumina polishing manufacturer
- Stable rare earth raw material supply chain
- Customized particle engineering capability
- Consistent batch-to-batch quality control
- Technical support for polishing process optimization
Product Highlights
Ultra-Fine Cerium Oxide Polishing Powder For Semiconductor And Precision Optics Finishing Product Overview Designed for advanced semiconductor and ultra-precision optical finishing, this ultra-fine ceria polishing powder provides exceptional surface planarization and defect minimization. The ...
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