High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing
製品詳細
| 純度: | ≥ 99.9% | 固形物: | 5～30重量% |
|---|---|---|---|
| 粒径(D50): | 50～150nm | Ph 範囲: | カスタマイズ可能 |
| 欠陥密度: | 超低い | 分散安定性: | 素晴らしい |
| ハイライト |
cerium oxide CMP slurry,silicon wafer polishing slurry,semiconductor CMP slurry |
||
製品の説明
High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing
Product Overview
Our cerium oxide CMP polishing slurry is engineered for ultra-precision planarization of silicon wafers used in advanced semiconductor manufacturing. The slurry combines controlled mechanical abrasion with optimized chemical activity to achieve excellent surface flatness, low defectivity, and superior wafer surface integrity.
Designed for modern CMP processes, the formulation provides stable removal rates while minimizing microscratches, particle contamination, and surface damage. The product supports high-yield production environments requiring consistent wafer quality and process repeatability.
Key Technical Advantages
- Ultra-low defectivity polishing performance
- Controlled silicon removal rate
- Excellent surface planarity and uniformity
- Reduced microscratch generation
- Stable slurry dispersion and long lifetime
- Compatible with automated CMP equipment
- High batch-to-batch consistency
Particle Size Distribution
Applications
- Silicon wafer planarization
- Prime wafer finishing
- Device wafer surface polishing
- CMP pre-clean polishing steps
- Semiconductor substrate preparation
製品 ハイライト
High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing Product Overview Our cerium oxide CMP polishing slurry is engineered for ultra-precision planarization of silicon wafers used in advanced semiconductor manufacturing. The slurry combines controlled ...
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Advanced Ceria CMP Slurry For Silicon Wafer Polishing And Semiconductor Surface Planarization
Advanced Ceria CMP Slurry For Silicon Wafer Polishing And Semiconductor Surface Planarization Product Overview This advanced ceria-based CMP slurry is optimized for high-precision silicon wafer polishing where nanoscale surface control is required. The chemically active cerium oxide particles promote efficient material removal while preserving crystal integrity and minimizing subsurface damage. The slurry enables improved wafer flatness, reduced dishing and erosion effects,
High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing
High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing Product Overview Our cerium oxide CMP polishing slurry is engineered for ultra-precision planarization of silicon wafers used in advanced semiconductor manufacturing. The slurry combines controlled mechanical abrasion with optimized chemical activity to achieve excellent surface flatness, low defectivity, and superior wafer surface integrity. Designed for modern CMP processes,
競争力のある価格の希土類材料炭酸セリウム白色粉末
Cerium Carbonate Molecular Formula: Ce₂(CO₃)₃ Appearance: Cerium carbonate is a white powder Application: Used in the manufacture of automobile exhaust purifiers, and also as an intermediate for producing metallic cerium, cerium oxide and other cerium compounds. Item Specification Testing Standard Item Ce 2 (CO 3 ) 3 -3N5B Ce 2 (CO 3 ) 3 -4NB Ce 2 (CO 3 ) 3 -4N5B Ce 2 (CO 3 ) 3 -5NB TREO(wt%) 45～50 45～50 45～50 45～50 Rare Earth Relative Purity (wt%) La 2 O 3 /TREO ≤0.01 ≤0.005
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