Quality High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing factory
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Quality High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing factory
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High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing

Brand Name: LICHEN
Model Number: LC
Place of Origin: CHINA
Certification: ISO
Minimum Order Quantity: 20KGS
Price: Contact us
Supply Ability: 3000MT/YEAR

Product Details


Purity: ≥ 99.9% Solid Content: 5-30 Wt%
Particle Size (D50): 50 – 150 Nm PH Range: Customizable
Defect Density: Ultra-Low Dispersion Stability: Excellent
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cerium oxide CMP slurry

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silicon wafer polishing slurry

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semiconductor CMP slurry

Product Description


High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing

Product Overview

Our cerium oxide CMP polishing slurry is engineered for ultra-precision planarization of silicon wafers used in advanced semiconductor manufacturing. The slurry combines controlled mechanical abrasion with optimized chemical activity to achieve excellent surface flatness, low defectivity, and superior wafer surface integrity.

Designed for modern CMP processes, the formulation provides stable removal rates while minimizing microscratches, particle contamination, and surface damage. The product supports high-yield production environments requiring consistent wafer quality and process repeatability.

Key Technical Advantages

  • Ultra-low defectivity polishing performance
  • Controlled silicon removal rate
  • Excellent surface planarity and uniformity
  • Reduced microscratch generation
  • Stable slurry dispersion and long lifetime
  • Compatible with automated CMP equipment
  • High batch-to-batch consistency


Particle Size Distribution

High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing 0

Applications

  • Silicon wafer planarization
  • Prime wafer finishing
  • Device wafer surface polishing
  • CMP pre-clean polishing steps
  • Semiconductor substrate preparation

Product Highlights

High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing Product Overview Our cerium oxide CMP polishing slurry is engineered for ultra-precision planarization of silicon wafers used in advanced semiconductor manufacturing. The slurry combines controlled ...

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